Fabrication of sub-micron 3-D structure using duo-mold UV-RIL process

Kang Soo Han, Sung Hoon Hong, Jun Ho Jeong, Heon Lee

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

3-D polymeric micro- and nano-structures were fabricated by the reversal imprint lithography technique using nano-patterned molds. A surface-treated quartz mold and a water-soluble poly vinyl alcohol (PVA) mold were used to make dual-side patterned, 2-D polymeric, micro- and nano-structures. First, UV-curable, polymeric resin was dropped onto the quartz mold, which was then covered with the PVA mold. The two stacked molds were pressed and exposed to UV-light to cure the resin. The cured polymeric resin (the reversal layer) was easily released from the quartz mold, because the surface of the latter was treated with an anti-stiction layer. The reversal layer, bound to the PVA mold, was transferred to a Si substrate by applying a thin layer of a UV-curable bonding agent. After bonding the reversal layer, the PVA mold was selectively removed by dipping in water. As a result, the dual-side patterned, thin polymeric 2-D structure was formed on the silicon substrate and, by repeating this process, 2-D nano-structures were stacked to form a 3-D nano-structure. By making use of the anti-stiction-treated, quartz mold and the water-soluble characteristic of the PVA material, the reliable release of the reversal layer was achieved.

Original languageEnglish
Pages (from-to)610-613
Number of pages4
JournalMicroelectronic Engineering
Volume87
Issue number4
DOIs
Publication statusPublished - 2010 Apr 1

Fingerprint

Quartz
Alcohols
Fabrication
fabrication
Stiction
Resins
alcohols
Molds
Water
quartz
resins
stiction
Microstructure
Silicon
Substrates
Fungi
Ultraviolet radiation
Lithography
water
microstructure

Keywords

  • NIL(nano-imprint lithography)
  • PVA(poly vinyl alcohol)
  • Residual thickness
  • RIL(reversal imprint lithography)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

Cite this

Fabrication of sub-micron 3-D structure using duo-mold UV-RIL process. / Han, Kang Soo; Hong, Sung Hoon; Jeong, Jun Ho; Lee, Heon.

In: Microelectronic Engineering, Vol. 87, No. 4, 01.04.2010, p. 610-613.

Research output: Contribution to journalArticle

Han, Kang Soo ; Hong, Sung Hoon ; Jeong, Jun Ho ; Lee, Heon. / Fabrication of sub-micron 3-D structure using duo-mold UV-RIL process. In: Microelectronic Engineering. 2010 ; Vol. 87, No. 4. pp. 610-613.
@article{3a6fcedbda244db4b7a6a65df531c14b,
title = "Fabrication of sub-micron 3-D structure using duo-mold UV-RIL process",
abstract = "3-D polymeric micro- and nano-structures were fabricated by the reversal imprint lithography technique using nano-patterned molds. A surface-treated quartz mold and a water-soluble poly vinyl alcohol (PVA) mold were used to make dual-side patterned, 2-D polymeric, micro- and nano-structures. First, UV-curable, polymeric resin was dropped onto the quartz mold, which was then covered with the PVA mold. The two stacked molds were pressed and exposed to UV-light to cure the resin. The cured polymeric resin (the reversal layer) was easily released from the quartz mold, because the surface of the latter was treated with an anti-stiction layer. The reversal layer, bound to the PVA mold, was transferred to a Si substrate by applying a thin layer of a UV-curable bonding agent. After bonding the reversal layer, the PVA mold was selectively removed by dipping in water. As a result, the dual-side patterned, thin polymeric 2-D structure was formed on the silicon substrate and, by repeating this process, 2-D nano-structures were stacked to form a 3-D nano-structure. By making use of the anti-stiction-treated, quartz mold and the water-soluble characteristic of the PVA material, the reliable release of the reversal layer was achieved.",
keywords = "NIL(nano-imprint lithography), PVA(poly vinyl alcohol), Residual thickness, RIL(reversal imprint lithography)",
author = "Han, {Kang Soo} and Hong, {Sung Hoon} and Jeong, {Jun Ho} and Heon Lee",
year = "2010",
month = "4",
day = "1",
doi = "10.1016/j.mee.2009.08.022",
language = "English",
volume = "87",
pages = "610--613",
journal = "Microelectronic Engineering",
issn = "0167-9317",
publisher = "Elsevier",
number = "4",

}

TY - JOUR

T1 - Fabrication of sub-micron 3-D structure using duo-mold UV-RIL process

AU - Han, Kang Soo

AU - Hong, Sung Hoon

AU - Jeong, Jun Ho

AU - Lee, Heon

PY - 2010/4/1

Y1 - 2010/4/1

N2 - 3-D polymeric micro- and nano-structures were fabricated by the reversal imprint lithography technique using nano-patterned molds. A surface-treated quartz mold and a water-soluble poly vinyl alcohol (PVA) mold were used to make dual-side patterned, 2-D polymeric, micro- and nano-structures. First, UV-curable, polymeric resin was dropped onto the quartz mold, which was then covered with the PVA mold. The two stacked molds were pressed and exposed to UV-light to cure the resin. The cured polymeric resin (the reversal layer) was easily released from the quartz mold, because the surface of the latter was treated with an anti-stiction layer. The reversal layer, bound to the PVA mold, was transferred to a Si substrate by applying a thin layer of a UV-curable bonding agent. After bonding the reversal layer, the PVA mold was selectively removed by dipping in water. As a result, the dual-side patterned, thin polymeric 2-D structure was formed on the silicon substrate and, by repeating this process, 2-D nano-structures were stacked to form a 3-D nano-structure. By making use of the anti-stiction-treated, quartz mold and the water-soluble characteristic of the PVA material, the reliable release of the reversal layer was achieved.

AB - 3-D polymeric micro- and nano-structures were fabricated by the reversal imprint lithography technique using nano-patterned molds. A surface-treated quartz mold and a water-soluble poly vinyl alcohol (PVA) mold were used to make dual-side patterned, 2-D polymeric, micro- and nano-structures. First, UV-curable, polymeric resin was dropped onto the quartz mold, which was then covered with the PVA mold. The two stacked molds were pressed and exposed to UV-light to cure the resin. The cured polymeric resin (the reversal layer) was easily released from the quartz mold, because the surface of the latter was treated with an anti-stiction layer. The reversal layer, bound to the PVA mold, was transferred to a Si substrate by applying a thin layer of a UV-curable bonding agent. After bonding the reversal layer, the PVA mold was selectively removed by dipping in water. As a result, the dual-side patterned, thin polymeric 2-D structure was formed on the silicon substrate and, by repeating this process, 2-D nano-structures were stacked to form a 3-D nano-structure. By making use of the anti-stiction-treated, quartz mold and the water-soluble characteristic of the PVA material, the reliable release of the reversal layer was achieved.

KW - NIL(nano-imprint lithography)

KW - PVA(poly vinyl alcohol)

KW - Residual thickness

KW - RIL(reversal imprint lithography)

UR - http://www.scopus.com/inward/record.url?scp=75149178562&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=75149178562&partnerID=8YFLogxK

U2 - 10.1016/j.mee.2009.08.022

DO - 10.1016/j.mee.2009.08.022

M3 - Article

VL - 87

SP - 610

EP - 613

JO - Microelectronic Engineering

JF - Microelectronic Engineering

SN - 0167-9317

IS - 4

ER -