Abstract
This paper presents high cycle fatigue properties of an Al-3%Ti thin film, used in a RF (radio-frequency) MEMS switch for a mobile phone. The thickness and width of the thin film of specimen are 1.1μm and 480μm, respectively. Tensile tests of five specimens are performed, from which the ultimate strength is found to be 144MPa. High cycle fatigue tests of six specimens arc also performed, from which the fatigue strength coefficient and the fatigue strength exponent are found to be 336MPa and-0.1514, respectively.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems |
| Subtitle of host publication | Advances in Electronic Packaging 2005 |
| Pages | 1725-1730 |
| Number of pages | 6 |
| Publication status | Published - 2006 Feb 23 |
| Event | ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States Duration: 2005 Jul 17 → 2005 Jul 22 |
Publication series
| Name | Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 |
|---|---|
| Volume | PART C |
Other
| Other | ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 |
|---|---|
| Country | United States |
| City | San Francisco, CA |
| Period | 05/7/17 → 05/7/22 |
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ASJC Scopus subject areas
- Engineering(all)
Cite this
Park, J. H., Choa, S. H., Choi, H. C., Myung, M. S., Lee, C. S., & Kim, Y. J. (2006). Fatigue test of AL-3%TI using axial loading testing machine for mems materials. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (pp. 1725-1730). (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; Vol. PART C).