Fatigue test of AL-3%TI using axial loading testing machine for mems materials

Jun Hyub Park, Sung Hoon Choa, Hyeon Chang Choi, Man Sik Myung, Chang Seung Lee, Yun Jae Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents high cycle fatigue properties of an Al-3%Ti thin film, used in a RF (radio-frequency) MEMS switch for a mobile phone. The thickness and width of the thin film of specimen are 1.1μm and 480μm, respectively. Tensile tests of five specimens are performed, from which the ultimate strength is found to be 144MPa. High cycle fatigue tests of six specimens arc also performed, from which the fatigue strength coefficient and the fatigue strength exponent are found to be 336MPa and-0.1514, respectively.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
Pages1725-1730
Number of pages6
Publication statusPublished - 2006 Feb 23
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: 2005 Jul 172005 Jul 22

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART C

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CountryUnited States
CitySan Francisco, CA
Period05/7/1705/7/22

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Park, J. H., Choa, S. H., Choi, H. C., Myung, M. S., Lee, C. S., & Kim, Y. J. (2006). Fatigue test of AL-3%TI using axial loading testing machine for mems materials. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (pp. 1725-1730). (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; Vol. PART C).