Ferrite polymer composite for improving the electromagnetic compatibility of semiconductor packaging

Kyoung Sik Moon, C. P. Wong, Soo Hyung Kim, Hyung Do Choi, Seung Han, Ho Gyu Yoon, Kwang Suck Suh

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

The complex permittivity and permeability of ferrite-filled polymer composites were studied at 50 MHz to 1 GHz, and their effects on the electromagnetic compatibility (EMC) of an integrated circuit (IC) package mounted on a printed wiring board (PWB) in the far- and near-field modes were investigated. Incorporating the ferrite particles into the polymer increased the real part of the complex permeability to 10-11 at 50 MHz, and the real part exhibited a frequency dependency over the applied frequency range (50 MHz to 1 GHz). The ferrite particle increased the magnetic loss (μ″ = 3-5) as well, which can absorb the magnetic energy of the incident electromagnetic wave. By coating the test IC package with the ferrite-polymer composite materials, the EMC level of the PWB was dramatically improved. This improvement may be due to the high magnetic loss of the ferrite-polymer composite.

Original languageEnglish
Pages (from-to)1711-1718
Number of pages8
JournalJournal of Electronic Materials
Volume36
Issue number12
DOIs
Publication statusPublished - 2007 Dec 1

Fingerprint

electromagnetic compatibility
Electromagnetic compatibility
packaging
Ferrite
ferrites
Packaging
Polymers
Semiconductor materials
composite materials
Composite materials
polymers
Magnetic leakage
wiring
Printed circuit boards
integrated circuits
Integrated circuits
permeability
Filled polymers
Electromagnetic waves
far fields

Keywords

  • Electromagnetic absorber
  • Electronic package
  • EMC
  • EMI
  • EMS
  • Ferrite
  • GTEM
  • Polymer composite

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)

Cite this

Ferrite polymer composite for improving the electromagnetic compatibility of semiconductor packaging. / Moon, Kyoung Sik; Wong, C. P.; Kim, Soo Hyung; Choi, Hyung Do; Han, Seung; Yoon, Ho Gyu; Suh, Kwang Suck.

In: Journal of Electronic Materials, Vol. 36, No. 12, 01.12.2007, p. 1711-1718.

Research output: Contribution to journalArticle

Moon, Kyoung Sik ; Wong, C. P. ; Kim, Soo Hyung ; Choi, Hyung Do ; Han, Seung ; Yoon, Ho Gyu ; Suh, Kwang Suck. / Ferrite polymer composite for improving the electromagnetic compatibility of semiconductor packaging. In: Journal of Electronic Materials. 2007 ; Vol. 36, No. 12. pp. 1711-1718.
@article{8d64aa44dfe64f82ac4148630b3e4dd0,
title = "Ferrite polymer composite for improving the electromagnetic compatibility of semiconductor packaging",
abstract = "The complex permittivity and permeability of ferrite-filled polymer composites were studied at 50 MHz to 1 GHz, and their effects on the electromagnetic compatibility (EMC) of an integrated circuit (IC) package mounted on a printed wiring board (PWB) in the far- and near-field modes were investigated. Incorporating the ferrite particles into the polymer increased the real part of the complex permeability to 10-11 at 50 MHz, and the real part exhibited a frequency dependency over the applied frequency range (50 MHz to 1 GHz). The ferrite particle increased the magnetic loss (μ″ = 3-5) as well, which can absorb the magnetic energy of the incident electromagnetic wave. By coating the test IC package with the ferrite-polymer composite materials, the EMC level of the PWB was dramatically improved. This improvement may be due to the high magnetic loss of the ferrite-polymer composite.",
keywords = "Electromagnetic absorber, Electronic package, EMC, EMI, EMS, Ferrite, GTEM, Polymer composite",
author = "Moon, {Kyoung Sik} and Wong, {C. P.} and Kim, {Soo Hyung} and Choi, {Hyung Do} and Seung Han and Yoon, {Ho Gyu} and Suh, {Kwang Suck}",
year = "2007",
month = "12",
day = "1",
doi = "10.1007/s11664-007-0267-5",
language = "English",
volume = "36",
pages = "1711--1718",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",
number = "12",

}

TY - JOUR

T1 - Ferrite polymer composite for improving the electromagnetic compatibility of semiconductor packaging

AU - Moon, Kyoung Sik

AU - Wong, C. P.

AU - Kim, Soo Hyung

AU - Choi, Hyung Do

AU - Han, Seung

AU - Yoon, Ho Gyu

AU - Suh, Kwang Suck

PY - 2007/12/1

Y1 - 2007/12/1

N2 - The complex permittivity and permeability of ferrite-filled polymer composites were studied at 50 MHz to 1 GHz, and their effects on the electromagnetic compatibility (EMC) of an integrated circuit (IC) package mounted on a printed wiring board (PWB) in the far- and near-field modes were investigated. Incorporating the ferrite particles into the polymer increased the real part of the complex permeability to 10-11 at 50 MHz, and the real part exhibited a frequency dependency over the applied frequency range (50 MHz to 1 GHz). The ferrite particle increased the magnetic loss (μ″ = 3-5) as well, which can absorb the magnetic energy of the incident electromagnetic wave. By coating the test IC package with the ferrite-polymer composite materials, the EMC level of the PWB was dramatically improved. This improvement may be due to the high magnetic loss of the ferrite-polymer composite.

AB - The complex permittivity and permeability of ferrite-filled polymer composites were studied at 50 MHz to 1 GHz, and their effects on the electromagnetic compatibility (EMC) of an integrated circuit (IC) package mounted on a printed wiring board (PWB) in the far- and near-field modes were investigated. Incorporating the ferrite particles into the polymer increased the real part of the complex permeability to 10-11 at 50 MHz, and the real part exhibited a frequency dependency over the applied frequency range (50 MHz to 1 GHz). The ferrite particle increased the magnetic loss (μ″ = 3-5) as well, which can absorb the magnetic energy of the incident electromagnetic wave. By coating the test IC package with the ferrite-polymer composite materials, the EMC level of the PWB was dramatically improved. This improvement may be due to the high magnetic loss of the ferrite-polymer composite.

KW - Electromagnetic absorber

KW - Electronic package

KW - EMC

KW - EMI

KW - EMS

KW - Ferrite

KW - GTEM

KW - Polymer composite

UR - http://www.scopus.com/inward/record.url?scp=36148987577&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=36148987577&partnerID=8YFLogxK

U2 - 10.1007/s11664-007-0267-5

DO - 10.1007/s11664-007-0267-5

M3 - Article

VL - 36

SP - 1711

EP - 1718

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 12

ER -