Ferrite polymer composite for improving the electromagnetic compatibility of semiconductor packaging

Kyoung Sik Moon, C. P. Wong, Soo Hyung Kim, Hyung Do Choi, Seung Han, Ho Gyu Yoon, Kwang S. Suh

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

The complex permittivity and permeability of ferrite-filled polymer composites were studied at 50 MHz to 1 GHz, and their effects on the electromagnetic compatibility (EMC) of an integrated circuit (IC) package mounted on a printed wiring board (PWB) in the far- and near-field modes were investigated. Incorporating the ferrite particles into the polymer increased the real part of the complex permeability to 10-11 at 50 MHz, and the real part exhibited a frequency dependency over the applied frequency range (50 MHz to 1 GHz). The ferrite particle increased the magnetic loss (μ″ = 3-5) as well, which can absorb the magnetic energy of the incident electromagnetic wave. By coating the test IC package with the ferrite-polymer composite materials, the EMC level of the PWB was dramatically improved. This improvement may be due to the high magnetic loss of the ferrite-polymer composite.

Original languageEnglish
Pages (from-to)1711-1718
Number of pages8
JournalJournal of Electronic Materials
Volume36
Issue number12
DOIs
Publication statusPublished - 2007 Dec

Keywords

  • EMC
  • EMI
  • EMS
  • Electromagnetic absorber
  • Electronic package
  • Ferrite
  • GTEM
  • Polymer composite

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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