Filler effect of low loss dielectricity in printed circuit board material

Dielectric properties of low-loss dielectric materials are investigated with variation of silica filler which is known to be general filler in PCB composite. With comparison of dielectric losses of various filler materials in use of BCB resin, it could be known that crystalline cristobalite was superior to other crystalline or amorphous silica-base materials and reduced dielectric losses in the composite with resin. And dielectric properties of composite with the variation of filler quantity showed that amorphous silica and quartz increased dielectric loss as their quantities increased, while cristobalite increased little. As quantity of crystalline cristobalite phase increases in cristobalite/quartz intermediates, dissipation factor decreases.