Fine-pitch, cost effective flip chip package development: TAB-BGA

Soojeoung Park, Sanggui Jo, Jiyong Park, Hyonchol Kim, Kawngjin Bae, Chulwoo Kim, Kyoungsei Choi, Sayoon Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper presents a cost effective fine-pitch flip chip solution to meet the increasing demand for the high performance small form factor packages. Tape Automated Bonding (TAB)-BGA package utilizes thermo-compression to bond a flip chip onto a film based substrate instead of reflow soldering. This approach allows for fine-pitch connection that can save significant substrate area, which can be especially cost effective for some package designs that can reduce the conductive layer count from 2 to 1 [1]. For second level interconnects, typical BGA approach was taken for easy adoption. Successfully implementing TAB-BGA has several technical challenges. Applying underfill under the fine-pitch flip chip without creating voids can be difficult. One way to overcome this challenge is by using no filler underfill and overmold type flip chip; however, that can potentially lead to high water absorption rate and delamination issues. Furthermore, board level reliability, especially temperature cycle, can have high failure rate for this type of single layer package structure [2]. To overcome these challenges, flexible PI film based substrate has been used to reduce the residual stress within the package. In addition, Epoxy Molding Compound (EMC) with low modulus at high temperature and solder resist stress buffer layer have been applied to improve the package and board level reliability.

Original languageEnglish
Title of host publication2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
Pages20-24
Number of pages5
DOIs
Publication statusPublished - 2010
Externally publishedYes
Event60th Electronic Components and Technology Conference, ECTC 2010 - Las Vegas, NV, United States
Duration: 2010 Jun 12010 Jun 4

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other60th Electronic Components and Technology Conference, ECTC 2010
CountryUnited States
CityLas Vegas, NV
Period10/6/110/6/4

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Park, S., Jo, S., Park, J., Kim, H., Bae, K., Kim, C., Choi, K., & Kang, S. (2010). Fine-pitch, cost effective flip chip package development: TAB-BGA. In 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010 (pp. 20-24). [5490879] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2010.5490879