Flexible polysilicon sensor array modules using "etch-release" packaging scheme

Eun Soo Hwang, Yong Jun Kim, Byeong Kwon Ju

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

A flexible polysilicon strain gauge array has been designed and fabricated using surface-micromachining with a SiO2 sacrificial layer. The realized sensor array is mechanically flexible, which can be attached on a non-planar surface. To realize the flexible polysilicon strain gauge array, a new packaging scheme using polysilicon/oxide-based surface-micromachining was developed. The proposed packaging scheme completes the strain sensor and the circuit board on a single process, which eliminates additional assembly and alignment problems. The measured gauge factor shows that it is more sensitive than conventional metal strain gauges. Unlike a single-crystal silicon strain gauge, a crystal direction does not affect its sensitivity in a polysilicon sensor, and this isotropic property makes the realization of an omni-directional strain gauge array possible. The proposed flexible strain sensor array can be used in a measurement of stress distribution of an arbitrary and non-planar surface.

Original languageEnglish
Pages (from-to)135-141
Number of pages7
JournalSensors and Actuators, A: Physical
Volume111
Issue number1
DOIs
Publication statusPublished - 2004 Mar 1
Externally publishedYes

Keywords

  • Flexible
  • Packaging
  • Piezporesistivity
  • Release-etching
  • Sensor array
  • Strain gauge

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Instrumentation

Fingerprint Dive into the research topics of 'Flexible polysilicon sensor array modules using "etch-release" packaging scheme'. Together they form a unique fingerprint.

  • Cite this