Flexible tactile sensor fabricated using polymer membrane

Woo Sung Cho, Kunnyun Kim, Kang Ryeol Lee, Yong Kook Kim, Dae Sung Lee, Won Hyo Kim, Nam Kyu Cho, Kwang Bum Park, Hyo Derk Park, Jung Ho Park, Byeong Kwon Ju

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)


We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor.

Original languageEnglish
Title of host publication2006 5th IEEE Conference on Sensors
Number of pages4
Publication statusPublished - 2006
Event2006 5th IEEE Conference on Sensors - Daegu, Korea, Republic of
Duration: 2006 Oct 222006 Oct 25

Publication series

NameProceedings of IEEE Sensors


Other2006 5th IEEE Conference on Sensors
Country/TerritoryKorea, Republic of

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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