Formation of a defect-free Pd-Cu-Ni ternary alloy membrane on a polished porous nickel support (PNS)

Shin Kun Ryi, Jong Soo Park, Sung Hyun Kim, Dong Won Kim, Kyu Il Cho

Research output: Contribution to journalArticle

30 Citations (Scopus)

Abstract

In order to decrease its resistance we enlarged the pore size of a porous nickel support (PNS) by using nickel powder with a larger particle size. The gas permeation test showed that this increased the gas permeation flux compared with the previous support. To make up for the various disadvantages, such as the enlarged surface roughness and pore size, a polishing process was introduced with sandpaper, followed by wet polishing with alumina powder. The polishing treatment was very effective in leveling off the surface of the porous nickel support, but it almost completely plugged the pores. Those pores blocked by the polishing process could be regenerated during Cu-reflow at 973 K by the upward diffusion of nickel and in this way a 12 μm defect-free Pd-Cu-Ni ternary alloy film was formed on the polished porous nickel support. Furthermore, we were able to obtain a three times higher hydrogen permeability than that reported in previous studies, because of the decreased support resistance of the porous nickel support.

Original languageEnglish
Pages (from-to)346-354
Number of pages9
JournalJournal of Membrane Science
Volume318
Issue number1-2
DOIs
Publication statusPublished - 2008 Jun 20

Fingerprint

Ternary alloys
ternary alloys
Nickel
nickel
membranes
Polishing
Membranes
polishing
Defects
defects
porosity
Permeation
Powders
Pore size
Gases
Aluminum Oxide
leveling
Particle Size
gases
Hydrogen

Keywords

  • Hydrogen separation
  • Polishing process
  • Porous nickel support
  • Sputtering
  • Surface modification

ASJC Scopus subject areas

  • Filtration and Separation
  • Polymers and Plastics

Cite this

Formation of a defect-free Pd-Cu-Ni ternary alloy membrane on a polished porous nickel support (PNS). / Ryi, Shin Kun; Park, Jong Soo; Kim, Sung Hyun; Kim, Dong Won; Cho, Kyu Il.

In: Journal of Membrane Science, Vol. 318, No. 1-2, 20.06.2008, p. 346-354.

Research output: Contribution to journalArticle

Ryi, Shin Kun ; Park, Jong Soo ; Kim, Sung Hyun ; Kim, Dong Won ; Cho, Kyu Il. / Formation of a defect-free Pd-Cu-Ni ternary alloy membrane on a polished porous nickel support (PNS). In: Journal of Membrane Science. 2008 ; Vol. 318, No. 1-2. pp. 346-354.
@article{88e0931decb041d6930c9c3f332c773a,
title = "Formation of a defect-free Pd-Cu-Ni ternary alloy membrane on a polished porous nickel support (PNS)",
abstract = "In order to decrease its resistance we enlarged the pore size of a porous nickel support (PNS) by using nickel powder with a larger particle size. The gas permeation test showed that this increased the gas permeation flux compared with the previous support. To make up for the various disadvantages, such as the enlarged surface roughness and pore size, a polishing process was introduced with sandpaper, followed by wet polishing with alumina powder. The polishing treatment was very effective in leveling off the surface of the porous nickel support, but it almost completely plugged the pores. Those pores blocked by the polishing process could be regenerated during Cu-reflow at 973 K by the upward diffusion of nickel and in this way a 12 μm defect-free Pd-Cu-Ni ternary alloy film was formed on the polished porous nickel support. Furthermore, we were able to obtain a three times higher hydrogen permeability than that reported in previous studies, because of the decreased support resistance of the porous nickel support.",
keywords = "Hydrogen separation, Polishing process, Porous nickel support, Sputtering, Surface modification",
author = "Ryi, {Shin Kun} and Park, {Jong Soo} and Kim, {Sung Hyun} and Kim, {Dong Won} and Cho, {Kyu Il}",
year = "2008",
month = "6",
day = "20",
doi = "10.1016/j.memsci.2008.02.055",
language = "English",
volume = "318",
pages = "346--354",
journal = "Jornal of Membrane Science",
issn = "0376-7388",
publisher = "Elsevier",
number = "1-2",

}

TY - JOUR

T1 - Formation of a defect-free Pd-Cu-Ni ternary alloy membrane on a polished porous nickel support (PNS)

AU - Ryi, Shin Kun

AU - Park, Jong Soo

AU - Kim, Sung Hyun

AU - Kim, Dong Won

AU - Cho, Kyu Il

PY - 2008/6/20

Y1 - 2008/6/20

N2 - In order to decrease its resistance we enlarged the pore size of a porous nickel support (PNS) by using nickel powder with a larger particle size. The gas permeation test showed that this increased the gas permeation flux compared with the previous support. To make up for the various disadvantages, such as the enlarged surface roughness and pore size, a polishing process was introduced with sandpaper, followed by wet polishing with alumina powder. The polishing treatment was very effective in leveling off the surface of the porous nickel support, but it almost completely plugged the pores. Those pores blocked by the polishing process could be regenerated during Cu-reflow at 973 K by the upward diffusion of nickel and in this way a 12 μm defect-free Pd-Cu-Ni ternary alloy film was formed on the polished porous nickel support. Furthermore, we were able to obtain a three times higher hydrogen permeability than that reported in previous studies, because of the decreased support resistance of the porous nickel support.

AB - In order to decrease its resistance we enlarged the pore size of a porous nickel support (PNS) by using nickel powder with a larger particle size. The gas permeation test showed that this increased the gas permeation flux compared with the previous support. To make up for the various disadvantages, such as the enlarged surface roughness and pore size, a polishing process was introduced with sandpaper, followed by wet polishing with alumina powder. The polishing treatment was very effective in leveling off the surface of the porous nickel support, but it almost completely plugged the pores. Those pores blocked by the polishing process could be regenerated during Cu-reflow at 973 K by the upward diffusion of nickel and in this way a 12 μm defect-free Pd-Cu-Ni ternary alloy film was formed on the polished porous nickel support. Furthermore, we were able to obtain a three times higher hydrogen permeability than that reported in previous studies, because of the decreased support resistance of the porous nickel support.

KW - Hydrogen separation

KW - Polishing process

KW - Porous nickel support

KW - Sputtering

KW - Surface modification

UR - http://www.scopus.com/inward/record.url?scp=43549106547&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=43549106547&partnerID=8YFLogxK

U2 - 10.1016/j.memsci.2008.02.055

DO - 10.1016/j.memsci.2008.02.055

M3 - Article

VL - 318

SP - 346

EP - 354

JO - Jornal of Membrane Science

JF - Jornal of Membrane Science

SN - 0376-7388

IS - 1-2

ER -