Full software analysis and impedance matching of radio frequency CMOS integrated circuits

Ki Hyuk Kim, Hoi Ju Chung, Sung Ho Yoon, Sung Woo Hwang, Jinwoo Park, Soo-Won Kim, Joongho Choi, Doyeol Ahn

Research output: Contribution to journalArticle

4 Citations (Scopus)


We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

Original languageEnglish
Pages (from-to)183-189
Number of pages7
JournalIEEE Transactions on Components and Packaging Technologies
Issue number1
Publication statusPublished - 2000 Jan 1


ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

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