Full software analysis and impedance matching of radio frequency CMOS integrated circuits

Ki Hyuk Kim, Hoi Ju Chung, Sung Ho Yoon, Sung Woo Hwang, Jinwoo Park, Soo Won Kim, Joongho Choi, Doyeol Ahn

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

Original languageEnglish
Pages (from-to)183-189
Number of pages7
JournalIEEE Transactions on Components and Packaging Technologies
Volume23
Issue number1
DOIs
Publication statusPublished - 2000

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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