Full software analysis and impedance matching of radio frequency CMOS integrated circuits

Ki Hyuk Kim, Hoi Ju Chung, Sung Ho Yoon, Sung Woo Hwang, Jinwoo Park, Soo-Won Kim, Joongho Choi, Doyeol Ahn

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

Original languageEnglish
Pages (from-to)183-189
Number of pages7
JournalIEEE Transactions on Components and Packaging Technologies
Volume23
Issue number1
DOIs
Publication statusPublished - 2000 Jan 1

Fingerprint

CMOS integrated circuits
Integrated circuits
Circuit simulation
Scattering parameters
Metals

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

Full software analysis and impedance matching of radio frequency CMOS integrated circuits. / Kim, Ki Hyuk; Chung, Hoi Ju; Yoon, Sung Ho; Hwang, Sung Woo; Park, Jinwoo; Kim, Soo-Won; Choi, Joongho; Ahn, Doyeol.

In: IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, 01.01.2000, p. 183-189.

Research output: Contribution to journalArticle

Kim, Ki Hyuk ; Chung, Hoi Ju ; Yoon, Sung Ho ; Hwang, Sung Woo ; Park, Jinwoo ; Kim, Soo-Won ; Choi, Joongho ; Ahn, Doyeol. / Full software analysis and impedance matching of radio frequency CMOS integrated circuits. In: IEEE Transactions on Components and Packaging Technologies. 2000 ; Vol. 23, No. 1. pp. 183-189.
@article{77ad863e1a3c4166807d67ed4fa07616,
title = "Full software analysis and impedance matching of radio frequency CMOS integrated circuits",
abstract = "We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.",
author = "Kim, {Ki Hyuk} and Chung, {Hoi Ju} and Yoon, {Sung Ho} and Hwang, {Sung Woo} and Jinwoo Park and Soo-Won Kim and Joongho Choi and Doyeol Ahn",
year = "2000",
month = "1",
day = "1",
doi = "10.1109/6144.833059",
language = "English",
volume = "23",
pages = "183--189",
journal = "IEEE Transactions on Components and Packaging Technologies",
issn = "1521-3331",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "1",

}

TY - JOUR

T1 - Full software analysis and impedance matching of radio frequency CMOS integrated circuits

AU - Kim, Ki Hyuk

AU - Chung, Hoi Ju

AU - Yoon, Sung Ho

AU - Hwang, Sung Woo

AU - Park, Jinwoo

AU - Kim, Soo-Won

AU - Choi, Joongho

AU - Ahn, Doyeol

PY - 2000/1/1

Y1 - 2000/1/1

N2 - We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

AB - We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique.

UR - http://www.scopus.com/inward/record.url?scp=0033886661&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033886661&partnerID=8YFLogxK

U2 - 10.1109/6144.833059

DO - 10.1109/6144.833059

M3 - Article

AN - SCOPUS:0033886661

VL - 23

SP - 183

EP - 189

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

SN - 1521-3331

IS - 1

ER -