GEQM: A quality metric for gray-level edge maps based on structural matching

Won Dong Jang, Jae Young Sim, Chang-Su Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An accurate quality metric, called GEQM, for gray-level edge maps based on the structural matching of edge pixels is proposed in this work. We design the positional matching cost, which reflects the distance between two edge pixels, and the structural matching cost, which measures the structural shapes of edges as well as the differences of edge strength levels. Based on the cost functions, we perform the graph-cut optimization to obtain the optimal pixel-based matching between source and target edge maps bidirectionally. Finally, we compute the GEQM score by summing up the optimal matching costs of all edge pixels. Experimental results show that the proposed GEQM performs the edge map quality assessment more accurately and more reliably than conventional metrics. Especially, GEQM is suitable for assessing the qualities of synthesized intermediate views in multi-view image processing.

Original languageEnglish
Title of host publicationICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages171-174
Number of pages4
ISBN (Print)9781479928927
DOIs
Publication statusPublished - 2014 Jan 1
Event2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014 - Florence, Italy
Duration: 2014 May 42014 May 9

Other

Other2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014
CountryItaly
CityFlorence
Period14/5/414/5/9

ASJC Scopus subject areas

  • Signal Processing
  • Software
  • Electrical and Electronic Engineering

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    Jang, W. D., Sim, J. Y., & Kim, C-S. (2014). GEQM: A quality metric for gray-level edge maps based on structural matching. In ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings (pp. 171-174). [6853580] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICASSP.2014.6853580