TY - GEN
T1 - Germanium for high performance MOSFETs and optical interconnects
AU - Saraswat, Krishna C.
AU - Kim, Donghyun
AU - Krishnamohan, Tejas
AU - Kuzum, Duygii
AU - Okyay, Ali K.
AU - Pethe, Abhijit
AU - Yu, Hyun Yong
N1 - Copyright:
Copyright 2010 Elsevier B.V., All rights reserved.
PY - 2008
Y1 - 2008
N2 - It is believed that to continue the scaling of silicon CMOS innovative device structures and new materials have to be created in order to continue the historic progress in information processing and transmission. Recently germanium has emerged as a viable candidate to augment Si for CMOS and optoelectronic applications. In this work we will first review recent results on growth of thin and thick films of Ge on Si, technology for appropriate cleaning of Ge, surface passivation using high-κ dielectrics, and metal induced crystallization of amorphous Ge and dopant activation. Next we will review application of Ge for high performance MOSFETs. Innovative Si/Ge MOS heterostructures will be described with high on current and low off currents. Finally we will describe optical detectors and modulators for on-chip and off-chip interconnect. Successful integration of Ge on Si should allow continued scaling of silicon CMOS to below 22 nm node.
AB - It is believed that to continue the scaling of silicon CMOS innovative device structures and new materials have to be created in order to continue the historic progress in information processing and transmission. Recently germanium has emerged as a viable candidate to augment Si for CMOS and optoelectronic applications. In this work we will first review recent results on growth of thin and thick films of Ge on Si, technology for appropriate cleaning of Ge, surface passivation using high-κ dielectrics, and metal induced crystallization of amorphous Ge and dopant activation. Next we will review application of Ge for high performance MOSFETs. Innovative Si/Ge MOS heterostructures will be described with high on current and low off currents. Finally we will describe optical detectors and modulators for on-chip and off-chip interconnect. Successful integration of Ge on Si should allow continued scaling of silicon CMOS to below 22 nm node.
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U2 - 10.1149/1.2986748
DO - 10.1149/1.2986748
M3 - Conference contribution
AN - SCOPUS:63149105309
SN - 9781566776561
T3 - ECS Transactions
SP - 3
EP - 12
BT - ECS Transactions - SiGe, Ge, and Related Compounds 3
T2 - 3rd SiGe, Ge, and Related Compounds: Materials, Processing and Devices Symposium - 214th ECS Meeting
Y2 - 12 October 2008 through 17 October 2008
ER -