Glass-to-glass electrostatic bonding for FED tubeless packaging application

Byeong Kwon Ju, Woo Beom Choi, Yun Hi Lee, Sung Jae Jung, Nam Yang Lee, Jeong In Han, Kyoung Ik Cho, Myung Hwan Oh

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

Original languageEnglish
Pages (from-to)839-844
Number of pages6
JournalMicroelectronics Journal
Issue number11
Publication statusPublished - 1998 Nov

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering


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