Glass-to-glass electrostatic bonding for FED tubeless packaging application

Byeong Kwon Ju, Woo Beom Choi, Yun-Hi Lee, Sung Jae Jung, Nam Yang Lee, Jeong In Han, Kyoung Ik Cho, Myung Hwan Oh

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

Original languageEnglish
Pages (from-to)839-844
Number of pages6
JournalMicroelectronics Journal
Volume29
Issue number11
Publication statusPublished - 1998 Nov 1
Externally publishedYes

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Ju, B. K., Choi, W. B., Lee, Y-H., Jung, S. J., Lee, N. Y., Han, J. I., Cho, K. I., & Oh, M. H. (1998). Glass-to-glass electrostatic bonding for FED tubeless packaging application. Microelectronics Journal, 29(11), 839-844.