Glass-to-glass electrostatic bonding for FED tubeless packaging application

Byeong Kwon Ju, Woo Beom Choi, Yun Hi Lee, Sung Jae Jung, Nam Yang Lee, Jeong In Han, Kyoung Ik Cho, Myung Hwan Oh

Research output: Contribution to journalArticle

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Physics & Astronomy

Chemical Compounds

Engineering & Materials Science