Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application

Duck Jung Lee, Yun-Hi Lee, Jin Jang, Byeong Kwon Ju

Research output: Contribution to journalArticle

28 Citations (Scopus)

Abstract

In this work, we have developed a new high vacuum packaging method using a glass-to-glass bonding with an intermediate amorphous silicon (a-Si) film for the application to microelectronic devices such as field emission display and plasma display panel. The glass-to-glass electrostatic bonding was established and optimized by introducing thin amorphous silicon interlayer. Also, we propose that the amount of oxygen ions is one of the important factors during the bonding process, as confirmed from the SIMS and XPS analyses for the reaction region of Si-O bond in interface. Our method was very effective to reduce the bonding temperature and make the high vacuum package of microelectronic devices over 10-4 Torr. Finally, to evaluate the vacuum sealing capability of devices packaged by the method, the leak characteristics of the vacuum was examined by a spinning rotor gauge during 6 months. The electron emission properties of the field emission display and plasma display panel were measured continuously for time variation.

Original languageEnglish
Pages (from-to)43-48
Number of pages6
JournalSensors and Actuators, A: Physical
Volume89
Issue number1-2
DOIs
Publication statusPublished - 2001 Mar 20
Externally publishedYes

Fingerprint

electrostatic bonding
silicon films
Amorphous silicon
packaging
microelectronics
Microelectronics
amorphous silicon
Electrostatics
Packaging
Vacuum
Field emission displays
Glass
vacuum
glass
high vacuum
field emission
Glass bonding
Display devices
Plasmas
Electron emission

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Instrumentation

Cite this

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