Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application

Duck Jung Lee, Yun Hi Lee, Jin Jang, Byeong Kwon Ju

Research output: Contribution to journalArticle

28 Citations (Scopus)

Fingerprint Dive into the research topics of 'Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds

Physics & Astronomy