Handoff provisioning in Bluetooth wireless personal area networks

Won Hee Lee, Yang Ick Joo, Kyun Hyon Tchah, Yongsuk Kim, Doo-Seop Eom

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

In this paper, we propose an efficient packet buffering in layer 2 to improve handoff performance in Wireless Personal Area Networks (WPAN) using Bluetooth technology. By packet buffering in layer 2, the handoff performance can be significantly improved with minimum system overhead and thus better QoS (Quality of Service) can be given-to the mobile WPAN users. The proposed packet buffering method, i.e., HQL2B (Handoff QoS Layer 2 Buffering), is especially useful to the WPAN users who utilize TCP connections. Recently some methods have been proposed especially for improving handoff performance in Bluetooth WAPN but unlike other works our method can improve handoff performance without any modification of TCP and Bluetooth specification. Through the simulations we show that the proposed method can greatly improve handoff performance in Bluetooth WPAN environment compared to other works.

Original languageEnglish
Pages (from-to)1004-1012
Number of pages9
JournalIEEE Transactions on Consumer Electronics
Volume49
Issue number4
DOIs
Publication statusPublished - 2003 Nov 1

Fingerprint

Personal communication systems
Bluetooth
Quality of service
Specifications

Keywords

  • Bluetooth
  • Handoff
  • Layer 2 buffering
  • WPAN

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications

Cite this

Handoff provisioning in Bluetooth wireless personal area networks. / Lee, Won Hee; Joo, Yang Ick; Tchah, Kyun Hyon; Kim, Yongsuk; Eom, Doo-Seop.

In: IEEE Transactions on Consumer Electronics, Vol. 49, No. 4, 01.11.2003, p. 1004-1012.

Research output: Contribution to journalArticle

Lee, Won Hee ; Joo, Yang Ick ; Tchah, Kyun Hyon ; Kim, Yongsuk ; Eom, Doo-Seop. / Handoff provisioning in Bluetooth wireless personal area networks. In: IEEE Transactions on Consumer Electronics. 2003 ; Vol. 49, No. 4. pp. 1004-1012.
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