Heat transfer and pressure drop characteristics in straight microchannel of printed circuit heat exchangers

Jang Won Seo, Yoon Ho Kim, Dongseon Kim, Young Don Choi, Kyu Jung Lee

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE), which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100-850 varying the hot-side inlet temperature between 40 °C-50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8% and 10%-15% higher, respectively, than those of the parallel flow. The average heat transfer rate, heat transfer performance and pressure drop increased with increasing Reynolds number in all experiments. Increasing inlet temperature did not affect the heat transfer performance while it slightly decreased the pressure drop in the experimental range considered. Empirical correlations have been developed for the heat transfer coefficient and pressure drop factor as functions of the Reynolds number.

Original languageEnglish
Pages (from-to)3438-3457
Number of pages20
JournalEntropy
Volume17
Issue number5
DOIs
Publication statusPublished - 2015

Fingerprint

printed circuits
heat exchangers
microchannels
pressure drop
heat transfer
Reynolds number
inlet temperature
side inlets
diffusion welding
parallel flow
performance tests
heat transfer coefficients
etching
configurations
temperature

Keywords

  • Counterflow
  • Diffusion bonding
  • Micro photo-etching
  • Microchannel
  • Printed circuit heat exchanger (PCHE)

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Heat transfer and pressure drop characteristics in straight microchannel of printed circuit heat exchangers. / Seo, Jang Won; Kim, Yoon Ho; Kim, Dongseon; Choi, Young Don; Lee, Kyu Jung.

In: Entropy, Vol. 17, No. 5, 2015, p. 3438-3457.

Research output: Contribution to journalArticle

Seo, Jang Won ; Kim, Yoon Ho ; Kim, Dongseon ; Choi, Young Don ; Lee, Kyu Jung. / Heat transfer and pressure drop characteristics in straight microchannel of printed circuit heat exchangers. In: Entropy. 2015 ; Vol. 17, No. 5. pp. 3438-3457.
@article{bb8764d9729a4a918d95b1d8b4f0ee6c,
title = "Heat transfer and pressure drop characteristics in straight microchannel of printed circuit heat exchangers",
abstract = "Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE), which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100-850 varying the hot-side inlet temperature between 40 °C-50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8{\%} and 10{\%}-15{\%} higher, respectively, than those of the parallel flow. The average heat transfer rate, heat transfer performance and pressure drop increased with increasing Reynolds number in all experiments. Increasing inlet temperature did not affect the heat transfer performance while it slightly decreased the pressure drop in the experimental range considered. Empirical correlations have been developed for the heat transfer coefficient and pressure drop factor as functions of the Reynolds number.",
keywords = "Counterflow, Diffusion bonding, Micro photo-etching, Microchannel, Printed circuit heat exchanger (PCHE)",
author = "Seo, {Jang Won} and Kim, {Yoon Ho} and Dongseon Kim and Choi, {Young Don} and Lee, {Kyu Jung}",
year = "2015",
doi = "10.3390/e17053438",
language = "English",
volume = "17",
pages = "3438--3457",
journal = "Entropy",
issn = "1099-4300",
publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",
number = "5",

}

TY - JOUR

T1 - Heat transfer and pressure drop characteristics in straight microchannel of printed circuit heat exchangers

AU - Seo, Jang Won

AU - Kim, Yoon Ho

AU - Kim, Dongseon

AU - Choi, Young Don

AU - Lee, Kyu Jung

PY - 2015

Y1 - 2015

N2 - Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE), which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100-850 varying the hot-side inlet temperature between 40 °C-50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8% and 10%-15% higher, respectively, than those of the parallel flow. The average heat transfer rate, heat transfer performance and pressure drop increased with increasing Reynolds number in all experiments. Increasing inlet temperature did not affect the heat transfer performance while it slightly decreased the pressure drop in the experimental range considered. Empirical correlations have been developed for the heat transfer coefficient and pressure drop factor as functions of the Reynolds number.

AB - Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE), which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100-850 varying the hot-side inlet temperature between 40 °C-50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8% and 10%-15% higher, respectively, than those of the parallel flow. The average heat transfer rate, heat transfer performance and pressure drop increased with increasing Reynolds number in all experiments. Increasing inlet temperature did not affect the heat transfer performance while it slightly decreased the pressure drop in the experimental range considered. Empirical correlations have been developed for the heat transfer coefficient and pressure drop factor as functions of the Reynolds number.

KW - Counterflow

KW - Diffusion bonding

KW - Micro photo-etching

KW - Microchannel

KW - Printed circuit heat exchanger (PCHE)

UR - http://www.scopus.com/inward/record.url?scp=84930074717&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84930074717&partnerID=8YFLogxK

U2 - 10.3390/e17053438

DO - 10.3390/e17053438

M3 - Article

VL - 17

SP - 3438

EP - 3457

JO - Entropy

JF - Entropy

SN - 1099-4300

IS - 5

ER -