Heterogeneous three-dimensional assembly of metamaterials and metadevices by modular transfer printing

Seungwoo Lee, Byungsoo Kang, Hohyun Keum, Alaa Alokaily, Hyun Sung Park, Numair Ahmed, John A. Rogers, Placid M. Ferreira, Seok Kim, Bumki Min

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A metamaterial transfer printing method done by adhesion switching of viscoelastic stamp is presented. 3-D stack of heterogeneous material can be built at a desired position regardless of target substrate even on cheese.

Original languageEnglish
Title of host publication2015 11th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467371094
DOIs
Publication statusPublished - 2016 Jan 7
Event11th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2015 - Busan, Korea, Republic of
Duration: 2015 Aug 242015 Aug 28

Publication series

Name2015 11th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2015
Volume2

Other

Other11th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2015
CountryKorea, Republic of
CityBusan
Period15/8/2415/8/28

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics

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  • Cite this

    Lee, S., Kang, B., Keum, H., Alokaily, A., Park, H. S., Ahmed, N., Rogers, J. A., Ferreira, P. M., Kim, S., & Min, B. (2016). Heterogeneous three-dimensional assembly of metamaterials and metadevices by modular transfer printing. In 2015 11th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2015 [7376145] (2015 11th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2015; Vol. 2). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CLEOPR.2015.7376145