High aspect ratio microreactor for MEMS fuel cells

Kyoung Won Na; Young Gyo Seo; Jae Wook Kim; Man Young Sung

doi:10.1109/EDSSC.2003.1283578

High aspect ratio microreactor for MEMS fuel cells

Kyoung Won Na, Young Gyo Seo, Jae Wook Kim, Man Young Sung

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In this paper, we investigated the fabrication of high aspect ratio micro molds using a commercially available AZ9260 positive photoresist® and a reactor for a miniature fuel cell having high aspect ratio structures with large surface area by metal plating in conjunction with the micromolds. A conventional contact mask aligner with standard UV light soures was used for creating micromolds. A photoresist thickness up to 24μm on a silicon substrate was accomplished by employing a multiple coating process. The line pitch of the electroplated metal line is 9μm (7.5μm reactor line width and 1.6μm space). The aspect ratio of about 15 was achieved in the structure of the microfabricated reactor with a 24μm thickness.

Original language	English
Title of host publication	2003 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	487-490
Number of pages	4
ISBN (Print)	0780377494, 9780780377493
DOIs	https://doi.org/10.1109/EDSSC.2003.1283578
Publication status	Published - 2003
Externally published	Yes
Event	IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003 - Tsimshatsui, Kowloon, Hong Kong Duration: 2003 Dec 16 → 2003 Dec 18

Other

Other	IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003
Country/Territory	Hong Kong
City	Tsimshatsui, Kowloon
Period	03/12/16 → 03/12/18

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/EDSSC.2003.1283578

Cite this

Na, KW, Seo, YG, Kim, JW & Sung, MY 2003, High aspect ratio microreactor for MEMS fuel cells. in 2003 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003., 1283578, Institute of Electrical and Electronics Engineers Inc., pp. 487-490, IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003, Tsimshatsui, Kowloon, Hong Kong, 03/12/16. https://doi.org/10.1109/EDSSC.2003.1283578

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title = "High aspect ratio microreactor for MEMS fuel cells",

abstract = "In this paper, we investigated the fabrication of high aspect ratio micro molds using a commercially available AZ9260 positive photoresist{\textregistered} and a reactor for a miniature fuel cell having high aspect ratio structures with large surface area by metal plating in conjunction with the micromolds. A conventional contact mask aligner with standard UV light soures was used for creating micromolds. A photoresist thickness up to 24μm on a silicon substrate was accomplished by employing a multiple coating process. The line pitch of the electroplated metal line is 9μm (7.5μm reactor line width and 1.6μm space). The aspect ratio of about 15 was achieved in the structure of the microfabricated reactor with a 24μm thickness.",

author = "Na, {Kyoung Won} and Seo, {Young Gyo} and Kim, {Jae Wook} and Sung, {Man Young}",

year = "2003",

doi = "10.1109/EDSSC.2003.1283578",

language = "English",

isbn = "0780377494",

pages = "487--490",

booktitle = "2003 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003 ; Conference date: 16-12-2003 Through 18-12-2003",

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AU - Na, Kyoung Won

AU - Seo, Young Gyo

AU - Kim, Jae Wook

AU - Sung, Man Young

PY - 2003

Y1 - 2003

N2 - In this paper, we investigated the fabrication of high aspect ratio micro molds using a commercially available AZ9260 positive photoresist® and a reactor for a miniature fuel cell having high aspect ratio structures with large surface area by metal plating in conjunction with the micromolds. A conventional contact mask aligner with standard UV light soures was used for creating micromolds. A photoresist thickness up to 24μm on a silicon substrate was accomplished by employing a multiple coating process. The line pitch of the electroplated metal line is 9μm (7.5μm reactor line width and 1.6μm space). The aspect ratio of about 15 was achieved in the structure of the microfabricated reactor with a 24μm thickness.

AB - In this paper, we investigated the fabrication of high aspect ratio micro molds using a commercially available AZ9260 positive photoresist® and a reactor for a miniature fuel cell having high aspect ratio structures with large surface area by metal plating in conjunction with the micromolds. A conventional contact mask aligner with standard UV light soures was used for creating micromolds. A photoresist thickness up to 24μm on a silicon substrate was accomplished by employing a multiple coating process. The line pitch of the electroplated metal line is 9μm (7.5μm reactor line width and 1.6μm space). The aspect ratio of about 15 was achieved in the structure of the microfabricated reactor with a 24μm thickness.

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DO - 10.1109/EDSSC.2003.1283578

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SN - 0780377494

SN - 9780780377493

SP - 487

EP - 490

BT - 2003 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003

Y2 - 16 December 2003 through 18 December 2003

ER -

High aspect ratio microreactor for MEMS fuel cells

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