High filler loading technique and its effects on the reliability of epoxy molding compound

Kyoung Sik Moon, Sung Deck Hwang, Ho Gyu Yoon, Je Hong Ryu, Sang Sun Woo

Research output: Chapter in Book/Report/Conference proceedingChapter

5 Citations (Scopus)

Abstract

High filler loading technique was evaluated using the simplified packing model proposed by Ouchiyama and Tanaka and its effect on the reliability of epoxy molding compound (EMC) was investigated. Maximum packing fraction, φm, with the mixing ratio for ternary spherical filler systems was calculated and it was found that the effect of macropores, which could be existed in the systems with more than 3 components of different filler size, should be considered in the calculation of φm in a given filler system. Based on the calculation very low minimum melt viscosity of about 200 poise could be obtained in EMC filled with 85 volume percent of silica. As the amount of filler in EMC was increased, several properties such as coefficients of thermal expansion, moisture absorption and strength were improved. However, the adhesive strength to alloy 42 leadframe was decreased with the content of filler. The adhesive strength was more rapidly decreased with the moisture absorption. From the analysis of the interface between EMC and leadframe with X-ray photoelectron spectroscopy, the principal adhesive mechanism was thought to be the hydrogen bond and thus the decrease of the adhesion was attributed to the failure of the hydrogen bond by the absorbed water. The higher adhesive strength of low amount of silica-filled EMC could be explained as the low viscosity and the short intermolecular spacing with the leadframe.

Original languageEnglish
Title of host publicationProceedings of the Electronic Packaging Technology Conference, EPTC
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Pages318-324
Number of pages7
Publication statusPublished - 1998 Dec 1
EventProceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98) - Singapore, Singapore
Duration: 1998 Dec 81998 Dec 10

Other

OtherProceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98)
CitySingapore, Singapore
Period98/12/898/12/10

Fingerprint

Sheet molding compounds
Fillers
Adhesives
Hydrogen bonds
Moisture
Silica
Viscosity
Thermal expansion
Adhesion
X ray photoelectron spectroscopy
Water

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Moon, K. S., Hwang, S. D., Yoon, H. G., Ryu, J. H., & Woo, S. S. (1998). High filler loading technique and its effects on the reliability of epoxy molding compound. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 318-324). Piscataway, NJ, United States: IEEE.

High filler loading technique and its effects on the reliability of epoxy molding compound. / Moon, Kyoung Sik; Hwang, Sung Deck; Yoon, Ho Gyu; Ryu, Je Hong; Woo, Sang Sun.

Proceedings of the Electronic Packaging Technology Conference, EPTC. Piscataway, NJ, United States : IEEE, 1998. p. 318-324.

Research output: Chapter in Book/Report/Conference proceedingChapter

Moon, KS, Hwang, SD, Yoon, HG, Ryu, JH & Woo, SS 1998, High filler loading technique and its effects on the reliability of epoxy molding compound. in Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE, Piscataway, NJ, United States, pp. 318-324, Proceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98), Singapore, Singapore, 98/12/8.
Moon KS, Hwang SD, Yoon HG, Ryu JH, Woo SS. High filler loading technique and its effects on the reliability of epoxy molding compound. In Proceedings of the Electronic Packaging Technology Conference, EPTC. Piscataway, NJ, United States: IEEE. 1998. p. 318-324
Moon, Kyoung Sik ; Hwang, Sung Deck ; Yoon, Ho Gyu ; Ryu, Je Hong ; Woo, Sang Sun. / High filler loading technique and its effects on the reliability of epoxy molding compound. Proceedings of the Electronic Packaging Technology Conference, EPTC. Piscataway, NJ, United States : IEEE, 1998. pp. 318-324
@inbook{1a91b13da5fa4504a347a94bc06a5fac,
title = "High filler loading technique and its effects on the reliability of epoxy molding compound",
abstract = "High filler loading technique was evaluated using the simplified packing model proposed by Ouchiyama and Tanaka and its effect on the reliability of epoxy molding compound (EMC) was investigated. Maximum packing fraction, φm, with the mixing ratio for ternary spherical filler systems was calculated and it was found that the effect of macropores, which could be existed in the systems with more than 3 components of different filler size, should be considered in the calculation of φm in a given filler system. Based on the calculation very low minimum melt viscosity of about 200 poise could be obtained in EMC filled with 85 volume percent of silica. As the amount of filler in EMC was increased, several properties such as coefficients of thermal expansion, moisture absorption and strength were improved. However, the adhesive strength to alloy 42 leadframe was decreased with the content of filler. The adhesive strength was more rapidly decreased with the moisture absorption. From the analysis of the interface between EMC and leadframe with X-ray photoelectron spectroscopy, the principal adhesive mechanism was thought to be the hydrogen bond and thus the decrease of the adhesion was attributed to the failure of the hydrogen bond by the absorbed water. The higher adhesive strength of low amount of silica-filled EMC could be explained as the low viscosity and the short intermolecular spacing with the leadframe.",
author = "Moon, {Kyoung Sik} and Hwang, {Sung Deck} and Yoon, {Ho Gyu} and Ryu, {Je Hong} and Woo, {Sang Sun}",
year = "1998",
month = "12",
day = "1",
language = "English",
pages = "318--324",
booktitle = "Proceedings of the Electronic Packaging Technology Conference, EPTC",
publisher = "IEEE",

}

TY - CHAP

T1 - High filler loading technique and its effects on the reliability of epoxy molding compound

AU - Moon, Kyoung Sik

AU - Hwang, Sung Deck

AU - Yoon, Ho Gyu

AU - Ryu, Je Hong

AU - Woo, Sang Sun

PY - 1998/12/1

Y1 - 1998/12/1

N2 - High filler loading technique was evaluated using the simplified packing model proposed by Ouchiyama and Tanaka and its effect on the reliability of epoxy molding compound (EMC) was investigated. Maximum packing fraction, φm, with the mixing ratio for ternary spherical filler systems was calculated and it was found that the effect of macropores, which could be existed in the systems with more than 3 components of different filler size, should be considered in the calculation of φm in a given filler system. Based on the calculation very low minimum melt viscosity of about 200 poise could be obtained in EMC filled with 85 volume percent of silica. As the amount of filler in EMC was increased, several properties such as coefficients of thermal expansion, moisture absorption and strength were improved. However, the adhesive strength to alloy 42 leadframe was decreased with the content of filler. The adhesive strength was more rapidly decreased with the moisture absorption. From the analysis of the interface between EMC and leadframe with X-ray photoelectron spectroscopy, the principal adhesive mechanism was thought to be the hydrogen bond and thus the decrease of the adhesion was attributed to the failure of the hydrogen bond by the absorbed water. The higher adhesive strength of low amount of silica-filled EMC could be explained as the low viscosity and the short intermolecular spacing with the leadframe.

AB - High filler loading technique was evaluated using the simplified packing model proposed by Ouchiyama and Tanaka and its effect on the reliability of epoxy molding compound (EMC) was investigated. Maximum packing fraction, φm, with the mixing ratio for ternary spherical filler systems was calculated and it was found that the effect of macropores, which could be existed in the systems with more than 3 components of different filler size, should be considered in the calculation of φm in a given filler system. Based on the calculation very low minimum melt viscosity of about 200 poise could be obtained in EMC filled with 85 volume percent of silica. As the amount of filler in EMC was increased, several properties such as coefficients of thermal expansion, moisture absorption and strength were improved. However, the adhesive strength to alloy 42 leadframe was decreased with the content of filler. The adhesive strength was more rapidly decreased with the moisture absorption. From the analysis of the interface between EMC and leadframe with X-ray photoelectron spectroscopy, the principal adhesive mechanism was thought to be the hydrogen bond and thus the decrease of the adhesion was attributed to the failure of the hydrogen bond by the absorbed water. The higher adhesive strength of low amount of silica-filled EMC could be explained as the low viscosity and the short intermolecular spacing with the leadframe.

UR - http://www.scopus.com/inward/record.url?scp=0032230716&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032230716&partnerID=8YFLogxK

M3 - Chapter

AN - SCOPUS:0032230716

SP - 318

EP - 324

BT - Proceedings of the Electronic Packaging Technology Conference, EPTC

PB - IEEE

CY - Piscataway, NJ, United States

ER -