High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

Jae Ho Han, Jichai Jeong

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

Original languageEnglish
Pages (from-to)365-367
Number of pages3
JournalMicrowave and Optical Technology Letters
Volume43
Issue number5
DOIs
Publication statusPublished - 2004 Dec 5

Keywords

  • Bonding
  • Circuit modeling
  • Coplanar waveguides
  • Packaging

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package'. Together they form a unique fingerprint.

  • Cite this