High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-dil package

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Coplanar-waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini-DIL package. For microwave-circuit simulation of the package, equivalent electric-circuit modeling of die-attached components with wire-bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted.

Original languageEnglish
Pages (from-to)365-367
Number of pages3
JournalMicrowave and Optical Technology Letters
Issue number5
Publication statusPublished - 2004 Dec 5



  • Bonding
  • Circuit modeling
  • Coplanar waveguides
  • Packaging

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics

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