High performance modules of 2.5 Gbps modulator integrated DFB lasers using new RF impedance matching technique

S. H. Lee, J. H. Ahn, Y. K. Oh, J. S. Ma, A. G. Choo, T. I. Kim, Yonggyoo Kim, Jichai Jeong

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

We report the improvement of frequency response characteristics of 2.5 Gbps modulator integrated distributed feedback (MI-DFB) laser modules using new impedance matching technique. Frequency responses for the fabricated module using the '+' shaped microstrip line for impedance matching have been significantly improved such as the RF return loss of 11 dB and the 3 dB frequency bandwidth of 4.1 GHz, compared to 6 dB return loss and 1.5 GHz bandwidth for the conventional module. These results can be also well predicted by the simulation of frequency responses for the modules. From the fabricated MI-DFB laser modules, good transmission performance has been obtained has been obtained up to 640 km.

Original languageEnglish
Pages (from-to)407-410
Number of pages4
JournalIEEE Transactions on Advanced Packaging
Volume24
Issue number3
DOIs
Publication statusPublished - 2001 Aug 1

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Distributed feedback lasers
Modulators
Frequency response
Bandwidth
Microstrip lines

Keywords

  • Distributed feedback lasers
  • Equivalent circuits
  • Frequency response
  • Impedance matching
  • Modulators
  • Scattering parameters
  • Simulation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

High performance modules of 2.5 Gbps modulator integrated DFB lasers using new RF impedance matching technique. / Lee, S. H.; Ahn, J. H.; Oh, Y. K.; Ma, J. S.; Choo, A. G.; Kim, T. I.; Kim, Yonggyoo; Jeong, Jichai.

In: IEEE Transactions on Advanced Packaging, Vol. 24, No. 3, 01.08.2001, p. 407-410.

Research output: Contribution to journalArticle

Lee, S. H. ; Ahn, J. H. ; Oh, Y. K. ; Ma, J. S. ; Choo, A. G. ; Kim, T. I. ; Kim, Yonggyoo ; Jeong, Jichai. / High performance modules of 2.5 Gbps modulator integrated DFB lasers using new RF impedance matching technique. In: IEEE Transactions on Advanced Packaging. 2001 ; Vol. 24, No. 3. pp. 407-410.
@article{1b114bcf685e4dbc909da4594286c03c,
title = "High performance modules of 2.5 Gbps modulator integrated DFB lasers using new RF impedance matching technique",
abstract = "We report the improvement of frequency response characteristics of 2.5 Gbps modulator integrated distributed feedback (MI-DFB) laser modules using new impedance matching technique. Frequency responses for the fabricated module using the '+' shaped microstrip line for impedance matching have been significantly improved such as the RF return loss of 11 dB and the 3 dB frequency bandwidth of 4.1 GHz, compared to 6 dB return loss and 1.5 GHz bandwidth for the conventional module. These results can be also well predicted by the simulation of frequency responses for the modules. From the fabricated MI-DFB laser modules, good transmission performance has been obtained has been obtained up to 640 km.",
keywords = "Distributed feedback lasers, Equivalent circuits, Frequency response, Impedance matching, Modulators, Scattering parameters, Simulation",
author = "Lee, {S. H.} and Ahn, {J. H.} and Oh, {Y. K.} and Ma, {J. S.} and Choo, {A. G.} and Kim, {T. I.} and Yonggyoo Kim and Jichai Jeong",
year = "2001",
month = "8",
day = "1",
doi = "10.1109/6040.938310",
language = "English",
volume = "24",
pages = "407--410",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "3",

}

TY - JOUR

T1 - High performance modules of 2.5 Gbps modulator integrated DFB lasers using new RF impedance matching technique

AU - Lee, S. H.

AU - Ahn, J. H.

AU - Oh, Y. K.

AU - Ma, J. S.

AU - Choo, A. G.

AU - Kim, T. I.

AU - Kim, Yonggyoo

AU - Jeong, Jichai

PY - 2001/8/1

Y1 - 2001/8/1

N2 - We report the improvement of frequency response characteristics of 2.5 Gbps modulator integrated distributed feedback (MI-DFB) laser modules using new impedance matching technique. Frequency responses for the fabricated module using the '+' shaped microstrip line for impedance matching have been significantly improved such as the RF return loss of 11 dB and the 3 dB frequency bandwidth of 4.1 GHz, compared to 6 dB return loss and 1.5 GHz bandwidth for the conventional module. These results can be also well predicted by the simulation of frequency responses for the modules. From the fabricated MI-DFB laser modules, good transmission performance has been obtained has been obtained up to 640 km.

AB - We report the improvement of frequency response characteristics of 2.5 Gbps modulator integrated distributed feedback (MI-DFB) laser modules using new impedance matching technique. Frequency responses for the fabricated module using the '+' shaped microstrip line for impedance matching have been significantly improved such as the RF return loss of 11 dB and the 3 dB frequency bandwidth of 4.1 GHz, compared to 6 dB return loss and 1.5 GHz bandwidth for the conventional module. These results can be also well predicted by the simulation of frequency responses for the modules. From the fabricated MI-DFB laser modules, good transmission performance has been obtained has been obtained up to 640 km.

KW - Distributed feedback lasers

KW - Equivalent circuits

KW - Frequency response

KW - Impedance matching

KW - Modulators

KW - Scattering parameters

KW - Simulation

UR - http://www.scopus.com/inward/record.url?scp=0035421221&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035421221&partnerID=8YFLogxK

U2 - 10.1109/6040.938310

DO - 10.1109/6040.938310

M3 - Article

VL - 24

SP - 407

EP - 410

JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

SN - 1521-3323

IS - 3

ER -