High-quality Cu-Ni solid solution/Ag ohmic contacts for flip-chip light-emitting diodes

Dong Seok Leem, June O. Song, J. S. Kwak, Y. Park, Tae Yeon Seong

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Fingerprint

Dive into the research topics of 'High-quality Cu-Ni solid solution/Ag ohmic contacts for flip-chip light-emitting diodes'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds