High quality silicon-nitride thin films grown by helium plasma-enhanced chemical vapor deposition

S. Lim, S. J. Kim, J. H. Jung, B. K. Ju, M. H. Oh, J. F. Wager

Research output: Contribution to conferencePaperpeer-review

6 Citations (Scopus)

Abstract

Silicon nitride (SiN) films with very high dielectric strength of more than 8 MV/cm were successfully deposited on Si wafers using helium plasma-enhanced chemical vapor deposition (He-PECVD) at very low deposition temperature. The quality of the SiN films was much better than that of the SiN films deposited by the conventional PECVD. Silicon oxynitride (SiON) films with index of refraction varying from 1.46 to 2.0 were also deposited on Corning-7059 glass substrate by controlling the gas flow rate using computer process controller.

Original languageEnglish
Pages406-410
Number of pages5
Publication statusPublished - 1996
Externally publishedYes
EventProceedings of the 1996 9th International Vacuum Microelectronics Conference, IVMC - St.Petersburg, Russia
Duration: 1996 Jul 71996 Jul 12

Other

OtherProceedings of the 1996 9th International Vacuum Microelectronics Conference, IVMC
CitySt.Petersburg, Russia
Period96/7/796/7/12

ASJC Scopus subject areas

  • Surfaces and Interfaces

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