TY - JOUR
T1 - Highly nanotextured nickel-electroplated bismuth vanadate micropillars for hotspot removal via air- and spray-cooling
AU - Kim, Taegun
AU - Park, Chanwoo
AU - Kim, Minwoo
AU - An, Seongpil
AU - Yoon, Sam S.
N1 - Funding Information:
This research was supported by the Technology Development Program to Solve Climate Changes of the National Research Foundation ( NRF ) funded by the Ministry of Science, ICT & Future Planning ( NRF-2016M1A2A2936760 ) and Advanced Research Center Program ( NRF-2013R1A5A1073861 ). The research was also supported by the KU-FRG Program ( K1822531 ) .
PY - 2020/8
Y1 - 2020/8
N2 - Overheating and hotspots in high-power and high-density microelectronics can cause device malfunction and shortened device lifespans; however, cooling films with highly textured surfaces may alleviate these concerns by efficiently removing and dissipating heat. In this study, the electrospraying of bismuth vanadate (BiVO4) facilitated the formation of micropillars via diffusion-limited aggregation, yielding a highly textured surface. This was subsequently metallized via Ni electroplating for use as an efficient heat-removing and -spreading film. Because of their large surface areas, the BiVO4 micropillars acted not only as heat removers and spreaders, but also as an electrically insulating layer that could prevent unexpected electrical shocks to the device underneath the cooling film. The thermal resistance, electrical insulating properties, heat dissipating features, and convective heat transfer coefficient of the BiVO4-Ni bilayer films were studied, and the films were characterized using X-ray photoelectron spectroscopy, X-ray diffraction, scanning electron microscopy, and transmission electron microscopy. The obtained cooling films were very flexible and light and could be readily attached to portable electronics without adding much weight. Such films could become commercially viable solutions for the problem of overheating in portable electronics.
AB - Overheating and hotspots in high-power and high-density microelectronics can cause device malfunction and shortened device lifespans; however, cooling films with highly textured surfaces may alleviate these concerns by efficiently removing and dissipating heat. In this study, the electrospraying of bismuth vanadate (BiVO4) facilitated the formation of micropillars via diffusion-limited aggregation, yielding a highly textured surface. This was subsequently metallized via Ni electroplating for use as an efficient heat-removing and -spreading film. Because of their large surface areas, the BiVO4 micropillars acted not only as heat removers and spreaders, but also as an electrically insulating layer that could prevent unexpected electrical shocks to the device underneath the cooling film. The thermal resistance, electrical insulating properties, heat dissipating features, and convective heat transfer coefficient of the BiVO4-Ni bilayer films were studied, and the films were characterized using X-ray photoelectron spectroscopy, X-ray diffraction, scanning electron microscopy, and transmission electron microscopy. The obtained cooling films were very flexible and light and could be readily attached to portable electronics without adding much weight. Such films could become commercially viable solutions for the problem of overheating in portable electronics.
KW - Bismuth vanadate (BiVO)
KW - Cooling film
KW - Electroplating
KW - Electrospraying
KW - Heat dissipation
KW - Heat spreader
KW - Micropillars
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U2 - 10.1016/j.ijheatmasstransfer.2020.119731
DO - 10.1016/j.ijheatmasstransfer.2020.119731
M3 - Article
AN - SCOPUS:85084366851
VL - 156
JO - International Journal of Heat and Mass Transfer
JF - International Journal of Heat and Mass Transfer
SN - 0017-9310
M1 - 119731
ER -