TY - JOUR
T1 - Highly thermally conductive and mechanically robust polyamide/graphite nanoplatelet composites via mechanochemical bonding techniques with plasma treatment
AU - You, Jiwan
AU - Choi, Han Hyeong
AU - Cho, Jaehyun
AU - Son, Jeong Gon
AU - Park, Min
AU - Lee, Sang Soo
AU - Park, Jong Hyuk
N1 - Funding Information:
This research was supported by a grant from the Fundamental R&D Program for Technology of World Premier Materials funded by the Ministry of Trade, Industry and Energy, Republic of Korea . We also acknowledge the financial support from the R&D Convergence Program of National Research Council of Science and Technology of Republic of Korea and a Korea Institute of Science and Technology internal project . S.-S. Lee appreciates the research grant from the KU-KIST Graduate School .
PY - 2018/5/26
Y1 - 2018/5/26
N2 - Heat sinks made from polymer/nanocarbon composites have great potential due to their excellent processability, light weight, and low production cost compared to metal heat sinks. However, the thermal conductivity and mechanical properties of conventional polymer/nanocarbon composites have been considered insufficient for practical use as heat sinks. Here, significant improvements in both the thermal conductivity and the mechanical properties of polymer/nanocarbon composites have been achieved by a facile approach, using mechanochemical bonding techniques with plasma treatment (MBP process). Polyamide 66 (PA66) and graphite nanoplatelets (GNPs) are compounded via the MBP process, which can enhance the interfacial affinity between PA66 and GNP and promote the uniform dispersion of GNPs in the composites. The resulting PA66/GNP composites exhibit greatly improved thermal conductivity and mechanical properties. In particular, the thermal conductivity and tensile strength of the composite containing 10 wt% GNPs are over 3 times and 2 times higher than those of the composite prepared via conventional processes, respectively. Moreover, in heating and cooling tests, excellent heat transfer and dissipation properties are observed in the MBP-processed composites, demonstrating their practical applicability as effective heat sinks. Thus, this approach can encourage the development of high-performance, low-cost heat sinks.
AB - Heat sinks made from polymer/nanocarbon composites have great potential due to their excellent processability, light weight, and low production cost compared to metal heat sinks. However, the thermal conductivity and mechanical properties of conventional polymer/nanocarbon composites have been considered insufficient for practical use as heat sinks. Here, significant improvements in both the thermal conductivity and the mechanical properties of polymer/nanocarbon composites have been achieved by a facile approach, using mechanochemical bonding techniques with plasma treatment (MBP process). Polyamide 66 (PA66) and graphite nanoplatelets (GNPs) are compounded via the MBP process, which can enhance the interfacial affinity between PA66 and GNP and promote the uniform dispersion of GNPs in the composites. The resulting PA66/GNP composites exhibit greatly improved thermal conductivity and mechanical properties. In particular, the thermal conductivity and tensile strength of the composite containing 10 wt% GNPs are over 3 times and 2 times higher than those of the composite prepared via conventional processes, respectively. Moreover, in heating and cooling tests, excellent heat transfer and dissipation properties are observed in the MBP-processed composites, demonstrating their practical applicability as effective heat sinks. Thus, this approach can encourage the development of high-performance, low-cost heat sinks.
KW - Heat sinks
KW - Mechanochemical bonding techniques
KW - Plasma treatment
KW - Polyamide/graphite nanoplatelet composites
KW - Thermal mechanical properties
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U2 - 10.1016/j.compscitech.2018.03.021
DO - 10.1016/j.compscitech.2018.03.021
M3 - Article
AN - SCOPUS:85044592768
SN - 0266-3538
VL - 160
SP - 245
EP - 254
JO - Composites Science and Technology
JF - Composites Science and Technology
ER -