Recently, thin films deposited on polymer substrates have been widely utilized as encapsulation barriers in electronic applications such as flexible displays, packaging films, and organic light-emitting diodes. The barrier and mechanical properties of these films are critical aspects when using them for protecting the inner modules of electronic devices from environmental factors such as moisture, oxygen, and sunlight. In particular, polymers can be degraded or decomposed more easily than other materials under such environmental conditions. Therefore, polymer films can be deposited using thin functional materials; however, suitable deposition methods for polymers are scarce owing to many limitations such as low melting/glass transition temperature, thermal degradation, and oxidation. In this study, a thin alumina oxide film was deposited on a high-density polyethylene blown film by using atomic layer deposition. The mechanical and barrier properties of the alumina oxide film deposited on the polyethylene film were characterized by a microtensile test and water vapor transmission rate test. Process conditions such as process temperature, plasma surface treatment, and number of cycles were varied to ascertain the reliability of the thin alumina oxide film deposited on the high-density polyethylene blown film. The results showed that the barrier property of the deposited film improved upon the application of plasma surface treatment, and that its mechanical properties varied under different process conditions.
|Journal||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films|
|Publication status||Published - 2014 Jan|
ASJC Scopus subject areas
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films