Influences of elastic stress and interfacial kinetic barrier on phase evolution paths of thin-film diffusion couples

Joo Youl Huh, Jong Pa Hong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An explicit, finite difference scheme was used to examine the effects of coherency stresses and interface kinetic barriers on the phase evolution of a binary, thin-film diffusion couple. Thin-films, initially consisting of alternating layers of two terminal phases, a and y, were held at a temperature at which the formation of an intermediate phase, β at α/γ interface was thermodynamically probable. When either the coherency stresses or interface kinetic barriers are present, the interfacial compositions become time-dependent and, thus, the formation of the thermodynamically stable β phase can be kinetically prohibited at the early stage of the evolution. Even if the initial α/γ thin-films have the same overall composition, the coherency constraint can result in different final equilibrium states depending on either the initial compositions of the a and y phases or the relative magnitudes of the interfacial kinetic barriers. When both the coherency constraint and interfacial kinetic barriers are present, an intermediate phase can repeatedly form and disappear during the evolution.

Original languageEnglish
Title of host publicationDiffusion and Defect Data Pt.B: Solid State Phenomena
Pages405-412
Number of pages8
Volume118
DOIs
Publication statusPublished - 2006 Dec 1
Event3rd Asian Conference on Heat Treatment of Materials,(AHTM '05) - Gyeongju, Korea, Republic of
Duration: 2005 Nov 102005 Nov 12

Publication series

NameDiffusion and Defect Data Pt.B: Solid State Phenomena
Volume118
ISSN (Print)10120394

Other

Other3rd Asian Conference on Heat Treatment of Materials,(AHTM '05)
CountryKorea, Republic of
CityGyeongju
Period05/11/1005/11/12

Fingerprint

Thin films
Kinetics
kinetics
thin films
Chemical analysis
Temperature
temperature
Haemophilus influenzae type b-polysaccharide vaccine-diphtheria toxoid conjugate

Keywords

  • Coherency stresses
  • Interfacial kinetic barrier
  • Numerical simulation
  • Phase evolution path
  • Thin-film diffusion couple

ASJC Scopus subject areas

  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Huh, J. Y., & Hong, J. P. (2006). Influences of elastic stress and interfacial kinetic barrier on phase evolution paths of thin-film diffusion couples. In Diffusion and Defect Data Pt.B: Solid State Phenomena (Vol. 118, pp. 405-412). (Diffusion and Defect Data Pt.B: Solid State Phenomena; Vol. 118). https://doi.org/10.4028/3-908451-25-6.405

Influences of elastic stress and interfacial kinetic barrier on phase evolution paths of thin-film diffusion couples. / Huh, Joo Youl; Hong, Jong Pa.

Diffusion and Defect Data Pt.B: Solid State Phenomena. Vol. 118 2006. p. 405-412 (Diffusion and Defect Data Pt.B: Solid State Phenomena; Vol. 118).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Huh, JY & Hong, JP 2006, Influences of elastic stress and interfacial kinetic barrier on phase evolution paths of thin-film diffusion couples. in Diffusion and Defect Data Pt.B: Solid State Phenomena. vol. 118, Diffusion and Defect Data Pt.B: Solid State Phenomena, vol. 118, pp. 405-412, 3rd Asian Conference on Heat Treatment of Materials,(AHTM '05), Gyeongju, Korea, Republic of, 05/11/10. https://doi.org/10.4028/3-908451-25-6.405
Huh JY, Hong JP. Influences of elastic stress and interfacial kinetic barrier on phase evolution paths of thin-film diffusion couples. In Diffusion and Defect Data Pt.B: Solid State Phenomena. Vol. 118. 2006. p. 405-412. (Diffusion and Defect Data Pt.B: Solid State Phenomena). https://doi.org/10.4028/3-908451-25-6.405
Huh, Joo Youl ; Hong, Jong Pa. / Influences of elastic stress and interfacial kinetic barrier on phase evolution paths of thin-film diffusion couples. Diffusion and Defect Data Pt.B: Solid State Phenomena. Vol. 118 2006. pp. 405-412 (Diffusion and Defect Data Pt.B: Solid State Phenomena).
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