Innovation ultra thin packaging for RF-MEMS devices

Yun Kwon Park, Yong Kook Kim, Chul Ju Kim, Byeong Kwon Ju, Jong Oh Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes for vertical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. To make up hermetic sealing, metal bonding (Au/Sn-Au) was used in the sealing line. Bonding strength after dipping in the water was about 60Mpa and there was no change. The packaged RF device has a reflection loss under -19 [dB] and a insertion loss of -0.54∼-0.67 [dB]. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

Original languageEnglish
Title of host publicationTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages903-906
Number of pages4
ISBN (Electronic)0780377311, 9780780377318
DOIs
Publication statusPublished - 2003
Event12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
Duration: 2003 Jun 82003 Jun 12

Publication series

NameTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
Volume1

Other

Other12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
CountryUnited States
CityBoston
Period03/6/803/6/12

Keywords

  • Chemical processes
  • Chemical technology
  • Gold
  • Optical reflection
  • Packaging
  • Radio frequency
  • Radiofrequency microelectromechanical systems
  • Silicon
  • Technological innovation
  • Wafer bonding

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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