Interconnection of multichannel polyimide electrodes using anisotropic conductive films (ACFs) for biomedical applications

Dong Hyun Baek, Ji Soo Park, Eun Joong Lee, Su Jung Shin, Jin Hee Moon, James Jungho Pak, Sang Hoon Lee

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

In this paper, we propose a method for interconnecting soft polyimide (PI) electrodes using anisotropic conductive films (ACFs). Reliable and automated bonding was achieved through development of a desktop thermocompressive bonding device that could simultaneously deliver appropriate temperatures and pressures to the interconnection area. The bonding conditions were optimized by changing the bonding temperature and bonding pressure. The electrical properties were characterized by measuring the contact resistance of the ACF bonding area, yielding a measure that was used to optimize the applied pressure and temperature. The optimal conditions consisted of applying a pressure of 4 kgf/cm2 and a temperature of 180 °C for 20 s. Although ACF base bonding is widely used in industry (e.g., liquid crystal display manufacturing), this study constitutes the first trial of a biomedical application. We performed a preliminary in vivo biocompatibility investigation of ACF bonded area. Using the optimized temperature and pressure conditions, we interconnected a 40-channel PI multielectrode device for measuring electroencephalography (EEG) signals from the skulls of mice. The electrical properties of electrode were characterized by measuring the impedance. Finally, EEG signals were measured from the mice skulls using the fabricated devices to investigate suitability for application to biomedical devices.

Original languageEnglish
Article number5674074
Pages (from-to)1466-1473
Number of pages8
JournalIEEE Transactions on Biomedical Engineering
Volume58
Issue number5
DOIs
Publication statusPublished - 2011 May 1

Fingerprint

Conductive films
Polyimides
Electrodes
Pressure
Temperature
Equipment and Supplies
Skull
Electroencephalography
Liquid Crystals
Electric properties
Electric Impedance
Industry
Contact resistance
Liquid crystal displays
Biocompatibility

Keywords

  • biomedical electrodes
  • Biomedical engineering
  • packaging
  • polyimide (PI) films

ASJC Scopus subject areas

  • Biomedical Engineering

Cite this

Interconnection of multichannel polyimide electrodes using anisotropic conductive films (ACFs) for biomedical applications. / Baek, Dong Hyun; Park, Ji Soo; Lee, Eun Joong; Shin, Su Jung; Moon, Jin Hee; Pak, James Jungho; Lee, Sang Hoon.

In: IEEE Transactions on Biomedical Engineering, Vol. 58, No. 5, 5674074, 01.05.2011, p. 1466-1473.

Research output: Contribution to journalArticle

@article{c3003abc49ba4029bbcd1d337ec92f06,
title = "Interconnection of multichannel polyimide electrodes using anisotropic conductive films (ACFs) for biomedical applications",
abstract = "In this paper, we propose a method for interconnecting soft polyimide (PI) electrodes using anisotropic conductive films (ACFs). Reliable and automated bonding was achieved through development of a desktop thermocompressive bonding device that could simultaneously deliver appropriate temperatures and pressures to the interconnection area. The bonding conditions were optimized by changing the bonding temperature and bonding pressure. The electrical properties were characterized by measuring the contact resistance of the ACF bonding area, yielding a measure that was used to optimize the applied pressure and temperature. The optimal conditions consisted of applying a pressure of 4 kgf/cm2 and a temperature of 180 °C for 20 s. Although ACF base bonding is widely used in industry (e.g., liquid crystal display manufacturing), this study constitutes the first trial of a biomedical application. We performed a preliminary in vivo biocompatibility investigation of ACF bonded area. Using the optimized temperature and pressure conditions, we interconnected a 40-channel PI multielectrode device for measuring electroencephalography (EEG) signals from the skulls of mice. The electrical properties of electrode were characterized by measuring the impedance. Finally, EEG signals were measured from the mice skulls using the fabricated devices to investigate suitability for application to biomedical devices.",
keywords = "biomedical electrodes, Biomedical engineering, packaging, polyimide (PI) films",
author = "Baek, {Dong Hyun} and Park, {Ji Soo} and Lee, {Eun Joong} and Shin, {Su Jung} and Moon, {Jin Hee} and Pak, {James Jungho} and Lee, {Sang Hoon}",
year = "2011",
month = "5",
day = "1",
doi = "10.1109/TBME.2010.2102020",
language = "English",
volume = "58",
pages = "1466--1473",
journal = "IEEE Transactions on Biomedical Engineering",
issn = "0018-9294",
publisher = "IEEE Computer Society",
number = "5",

}

TY - JOUR

T1 - Interconnection of multichannel polyimide electrodes using anisotropic conductive films (ACFs) for biomedical applications

AU - Baek, Dong Hyun

AU - Park, Ji Soo

AU - Lee, Eun Joong

AU - Shin, Su Jung

AU - Moon, Jin Hee

AU - Pak, James Jungho

AU - Lee, Sang Hoon

PY - 2011/5/1

Y1 - 2011/5/1

N2 - In this paper, we propose a method for interconnecting soft polyimide (PI) electrodes using anisotropic conductive films (ACFs). Reliable and automated bonding was achieved through development of a desktop thermocompressive bonding device that could simultaneously deliver appropriate temperatures and pressures to the interconnection area. The bonding conditions were optimized by changing the bonding temperature and bonding pressure. The electrical properties were characterized by measuring the contact resistance of the ACF bonding area, yielding a measure that was used to optimize the applied pressure and temperature. The optimal conditions consisted of applying a pressure of 4 kgf/cm2 and a temperature of 180 °C for 20 s. Although ACF base bonding is widely used in industry (e.g., liquid crystal display manufacturing), this study constitutes the first trial of a biomedical application. We performed a preliminary in vivo biocompatibility investigation of ACF bonded area. Using the optimized temperature and pressure conditions, we interconnected a 40-channel PI multielectrode device for measuring electroencephalography (EEG) signals from the skulls of mice. The electrical properties of electrode were characterized by measuring the impedance. Finally, EEG signals were measured from the mice skulls using the fabricated devices to investigate suitability for application to biomedical devices.

AB - In this paper, we propose a method for interconnecting soft polyimide (PI) electrodes using anisotropic conductive films (ACFs). Reliable and automated bonding was achieved through development of a desktop thermocompressive bonding device that could simultaneously deliver appropriate temperatures and pressures to the interconnection area. The bonding conditions were optimized by changing the bonding temperature and bonding pressure. The electrical properties were characterized by measuring the contact resistance of the ACF bonding area, yielding a measure that was used to optimize the applied pressure and temperature. The optimal conditions consisted of applying a pressure of 4 kgf/cm2 and a temperature of 180 °C for 20 s. Although ACF base bonding is widely used in industry (e.g., liquid crystal display manufacturing), this study constitutes the first trial of a biomedical application. We performed a preliminary in vivo biocompatibility investigation of ACF bonded area. Using the optimized temperature and pressure conditions, we interconnected a 40-channel PI multielectrode device for measuring electroencephalography (EEG) signals from the skulls of mice. The electrical properties of electrode were characterized by measuring the impedance. Finally, EEG signals were measured from the mice skulls using the fabricated devices to investigate suitability for application to biomedical devices.

KW - biomedical electrodes

KW - Biomedical engineering

KW - packaging

KW - polyimide (PI) films

UR - http://www.scopus.com/inward/record.url?scp=79955532514&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79955532514&partnerID=8YFLogxK

U2 - 10.1109/TBME.2010.2102020

DO - 10.1109/TBME.2010.2102020

M3 - Article

C2 - 21189231

AN - SCOPUS:79955532514

VL - 58

SP - 1466

EP - 1473

JO - IEEE Transactions on Biomedical Engineering

JF - IEEE Transactions on Biomedical Engineering

SN - 0018-9294

IS - 5

M1 - 5674074

ER -