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Interfacial oxide growth and filling-up behaviour of the micro-gap in silicon fusion bonding processes
B. K. Ju
, M. H. Oh, K. H. Tchah
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peer-review
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Chemical Compounds
Silicon
Oxides
Annealing
Fusion reactions
Electric properties
Atoms
Diodes
Plastic deformation
Ultrasonics
Scanning electron microscopy
Water
Temperature
Physics & Astronomy
fusion
wafers
atmospheres
oxides
annealing
silicon
plastic deformation
ultrasonics
solid state
diodes
electrical properties
scanning electron microscopy
cross sections
water
atoms
Engineering & Materials Science
Annealing
Oxides
Fusion reactions
Silicon
Electric properties
Atoms
Diodes
Plastic deformation
Ultrasonics
Scanning electron microscopy
Water
Temperature