Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition

Moon Kyu Cho; Jin Woo Cho; Jun Hua Wu; Ji Ung Cho; Young Jin Choi; Young Keun Kim

doi:10.1016/j.cap.2009.03.026

Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition

Moon Kyu Cho, Jin Woo Cho, Jun Hua Wu, Ji Ung Cho, Young Jin Choi, Young Keun Kim

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.

Original language	English
Pages (from-to)	57-59
Number of pages	3
Journal	Current Applied Physics
Volume	10
Issue number	1
DOIs	https://doi.org/10.1016/j.cap.2009.03.026
Publication status	Published - 2010 Jan

Keywords

Electrodeposition
Hardness
Magnetism
Texture
Thin films

ASJC Scopus subject areas

Materials Science(all)
Physics and Astronomy(all)

Access to Document

10.1016/j.cap.2009.03.026

Fingerprint Dive into the research topics of 'Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition'. Together they form a unique fingerprint.

Cite this

@article{3b2ea3208c274596a17201b267fd1d66,

title = "Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition",

abstract = "We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.",

keywords = "Electrodeposition, Hardness, Magnetism, Texture, Thin films",

author = "Cho, {Moon Kyu} and Cho, {Jin Woo} and Wu, {Jun Hua} and Cho, {Ji Ung} and Choi, {Young Jin} and Kim, {Young Keun}",

note = "Funding Information: This work was supported by the Korea Science and Engineering Foundation (No. R0A-2005-000-10105-0), the Seoul R&BD Program (No. 10920), the Korea Health 21 R&D Project (No. A050750), and by the Korea Research Foundation Grant (No. KRF-2004-005-D00057).",

year = "2010",

month = jan,

doi = "10.1016/j.cap.2009.03.026",

language = "English",

volume = "10",

pages = "57--59",

journal = "Current Applied Physics",

issn = "1567-1739",

publisher = "Elsevier",

number = "1",

}

TY - JOUR

T1 - Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition

AU - Cho, Moon Kyu

AU - Cho, Jin Woo

AU - Wu, Jun Hua

AU - Cho, Ji Ung

AU - Choi, Young Jin

AU - Kim, Young Keun

N1 - Funding Information: This work was supported by the Korea Science and Engineering Foundation (No. R0A-2005-000-10105-0), the Seoul R&BD Program (No. 10920), the Korea Health 21 R&D Project (No. A050750), and by the Korea Research Foundation Grant (No. KRF-2004-005-D00057).

PY - 2010/1

Y1 - 2010/1

N2 - We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.

AB - We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.

KW - Electrodeposition

KW - Hardness

KW - Magnetism

KW - Texture

KW - Thin films

UR - http://www.scopus.com/inward/record.url?scp=69249229731&partnerID=8YFLogxK

U2 - 10.1016/j.cap.2009.03.026

DO - 10.1016/j.cap.2009.03.026

M3 - Article

AN - SCOPUS:69249229731

VL - 10

SP - 57

EP - 59

JO - Current Applied Physics

JF - Current Applied Physics

SN - 1567-1739

IS - 1

ER -

Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Cite this