Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition

Moon Kyu Cho, Jin Woo Cho, Jun Hua Wu, Ji Ung Cho, Young Jin Choi, Young-geun Kim

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.

Original languageEnglish
Pages (from-to)57-59
Number of pages3
JournalCurrent Applied Physics
Volume10
Issue number1
DOIs
Publication statusPublished - 2010 Jan 1

Fingerprint

Electrodeposition
electrodeposition
Current density
current density
hardness
textures
Textures
Hardness
tensile strength
Tensile strength
mechanical properties
Mechanical properties

Keywords

  • Electrodeposition
  • Hardness
  • Magnetism
  • Texture
  • Thin films

ASJC Scopus subject areas

  • Materials Science(all)
  • Physics and Astronomy(all)

Cite this

Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition. / Cho, Moon Kyu; Cho, Jin Woo; Wu, Jun Hua; Cho, Ji Ung; Choi, Young Jin; Kim, Young-geun.

In: Current Applied Physics, Vol. 10, No. 1, 01.01.2010, p. 57-59.

Research output: Contribution to journalArticle

Cho, Moon Kyu ; Cho, Jin Woo ; Wu, Jun Hua ; Cho, Ji Ung ; Choi, Young Jin ; Kim, Young-geun. / Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition. In: Current Applied Physics. 2010 ; Vol. 10, No. 1. pp. 57-59.
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