Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition

Moon Kyu Cho, Jin Woo Cho, Jun Hua Wu, Ji Ung Cho, Young Jin Choi, Young-geun Kim

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Abstract

We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.

Original languageEnglish
Pages (from-to)57-59
Number of pages3
JournalCurrent Applied Physics
Volume10
Issue number1
DOIs
Publication statusPublished - 2010 Jan 1

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Keywords

  • Electrodeposition
  • Hardness
  • Magnetism
  • Texture
  • Thin films

ASJC Scopus subject areas

  • Materials Science(all)
  • Physics and Astronomy(all)

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