Abstract
We report the morphology, texture, mechanical properties of Ni films with nanosized grains prepared by electrodeposition as a function of current density. With an increase in current density, the morphology of the nanostructured films was greatly affected and the textures changed from face-centered cubic (1 1 1)- to (2 0 0)-orientation. Consequently, the textural and microstructural alteration exerted strong influence on the hardness of the films, leading to decrease in the hardness (in particular, the inverse Hall-Petch relation) as current density increased, attributed to the distribution of colonies of grain agglomerate and the variation of directional tensile strength.
| Original language | English |
|---|---|
| Pages (from-to) | 57-59 |
| Number of pages | 3 |
| Journal | Current Applied Physics |
| Volume | 10 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2010 Jan |
Keywords
- Electrodeposition
- Hardness
- Magnetism
- Texture
- Thin films
ASJC Scopus subject areas
- Materials Science(all)
- Physics and Astronomy(all)
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Cho, M. K., Cho, J. W., Wu, J. H., Cho, J. U., Choi, Y. J., & Kim, Y. K. (2010). Inverse Hall-Petch relation of nanostructured Ni films prepared by electrodeposition. Current Applied Physics, 10(1), 57-59. https://doi.org/10.1016/j.cap.2009.03.026