Investigation of Cu metallization for Si solar cells

Jinmo Kang, JaeSung You, ChoonSik Kang, James Jungho Pak, Donghwan Kim

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

For application of copper metallization to silicon solar cells, electrical resistivity of the electroplated Cu was investigated for different annealing conditions: the rapid thermal annealing (RTA) and the vacuum annealing at various temperatures. The characteristics of Ti as the diffusion barrier were also observed. The specific contact resistance between Si and Ti/Cu was measured using Kelvin test pattern. For 8-min electroplated sample, the lowest resistivity of 2.1 μΩcm was obtained at 300°C RTA condition. For Cu with Ti barrier, 400°C 2 min vacuum-annealed sample showed etch pits whereas 400°C RTA showed no etch pits. A vacuum annealing at 450°C for 30 min reduced the specific contact resistance to 7.2 × 10 -6 Ωcm 2.

Original languageEnglish
Pages (from-to)91-96
Number of pages6
JournalSolar Energy Materials and Solar Cells
Volume74
Issue number1-4
DOIs
Publication statusPublished - 2002 Oct 1

Fingerprint

Rapid thermal annealing
Metallizing
Solar cells
Vacuum
Annealing
Contact resistance
Diffusion barriers
Silicon solar cells
Copper
Temperature

Keywords

  • Contact resistance
  • Cu metallization
  • Etch pits
  • High efficiency
  • Silicon
  • Solar cells

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

Cite this

Investigation of Cu metallization for Si solar cells. / Kang, Jinmo; You, JaeSung; Kang, ChoonSik; Pak, James Jungho; Kim, Donghwan.

In: Solar Energy Materials and Solar Cells, Vol. 74, No. 1-4, 01.10.2002, p. 91-96.

Research output: Contribution to journalArticle

Kang, Jinmo ; You, JaeSung ; Kang, ChoonSik ; Pak, James Jungho ; Kim, Donghwan. / Investigation of Cu metallization for Si solar cells. In: Solar Energy Materials and Solar Cells. 2002 ; Vol. 74, No. 1-4. pp. 91-96.
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