Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

Myong Jae Yoo, Sang Hyun Kim, Seong Dae Park, Woo Sung Lee, Jong Woo Sun, Jae Hong Choi, Sahn Nahm

Research output: Contribution to journalArticle

46 Citations (Scopus)

Abstract

Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample.

Original languageEnglish
Pages (from-to)1158-1162
Number of pages5
JournalEuropean Polymer Journal
Volume46
Issue number5
DOIs
Publication statusPublished - 2010 May 1

Keywords

  • Activation energy
  • Cure kinetics
  • Cycloaliphatic epoxy resin
  • Differential scanning calorimetry

ASJC Scopus subject areas

  • Physics and Astronomy(all)
  • Organic Chemistry
  • Polymers and Plastics
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis'. Together they form a unique fingerprint.

  • Cite this