Investigation of wireless power transfer in multi-coil environment

Hyeonseok Hwang, Bumsoo Lee, Junil Moon, Sechun Park, Chan Hui Jeong, Soo Won Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this study, simulations and experiments on wireless power transfer (WPT) in a multi-coil environment are conducted under the conditions of multiple battery charging. A series-arrayed 4-coil system comprising one WPT system and three identical WPT systems placed in parallel are investigated in this work. We show that low-frequency wireless power transfer is affected by multiple coils placed in parallel within a confined area. The power transfer efficiency at low frequencies can be degraded by 20% as compared to that of a single WPT system.

Original languageEnglish
Title of host publication2014 IEEE International Conference on Consumer Electronics, ICCE 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages311-312
Number of pages2
ISBN (Print)9781479912919
DOIs
Publication statusPublished - 2014
Event2014 IEEE International Conference on Consumer Electronics, ICCE 2014 - Las Vegas, NV, United States
Duration: 2014 Jan 102014 Jan 13

Publication series

NameDigest of Technical Papers - IEEE International Conference on Consumer Electronics
ISSN (Print)0747-668X

Other

Other2014 IEEE International Conference on Consumer Electronics, ICCE 2014
CountryUnited States
CityLas Vegas, NV
Period14/1/1014/1/13

Keywords

  • Wireless power transfer
  • magnetic resonance coupling

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Hwang, H., Lee, B., Moon, J., Park, S., Jeong, C. H., & Kim, S. W. (2014). Investigation of wireless power transfer in multi-coil environment. In 2014 IEEE International Conference on Consumer Electronics, ICCE 2014 (pp. 311-312). [6776019] (Digest of Technical Papers - IEEE International Conference on Consumer Electronics). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCE.2014.6776019