Joint Downlink and Uplink Design for Wireless Powered Cloud Radio Access Networks

Jaein Kim, Hoon Lee, Seok Hwan Park, Inkyu Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work deals with a joint downlink and uplink design for wireless powered cloud radio access network, where a baseband processing unit (BBU) communicates with downlink and uplink users through multiple remote radio heads (RRHs) connected to the BBU via finite-capacity fronthaul links. In the downlink, the RRHs send information to the downlink users and transfer energy to the uplink users (ULUs). By using the harvested energy, each ULU transmits information to the BBU through the uplink channels. In this work, we maximize the uplink sum-rate of the ULUs subject to the minimum downlink rate constraint as well as the per-node transmit power and the fronthaul capacity constraints. Numerical results confirm the advantages of the proposed algorithm compared to baseline schemes.

Original languageEnglish
Title of host publicationProceedings of TENCON 2018 - 2018 IEEE Region 10 Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1313-1316
Number of pages4
ISBN (Electronic)9781538654576
DOIs
Publication statusPublished - 2019 Feb 22
Event2018 IEEE Region 10 Conference, TENCON 2018 - Jeju, Korea, Republic of
Duration: 2018 Oct 282018 Oct 31

Publication series

NameIEEE Region 10 Annual International Conference, Proceedings/TENCON
Volume2018-October
ISSN (Print)2159-3442
ISSN (Electronic)2159-3450

Conference

Conference2018 IEEE Region 10 Conference, TENCON 2018
CountryKorea, Republic of
CityJeju
Period18/10/2818/10/31

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ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

Kim, J., Lee, H., Park, S. H., & Lee, I. (2019). Joint Downlink and Uplink Design for Wireless Powered Cloud Radio Access Networks. In Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference (pp. 1313-1316). [8650384] (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2018-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.2018.8650384