TY - GEN
T1 - Laser-assisted maskless fabrication of flexible electronics
AU - Grigoropoulos, Costas P.
AU - Ko, Seung Hwan
AU - Pan, Heng
AU - Chung, Jaewon
AU - Poulikakos, Dimos
PY - 2007
Y1 - 2007
N2 - The low temperature fabrication of active (field effect transistor) electrical components on flexible polymer substrates is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print gold nano-particles suspended in organic solvent, PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent, semiconductor polymer in organic solvent to fabricate passive and active electrical components on flexible polymer substrates. Short pulsed laser ablation enabled finer electrical components to overcome the resolution limitation of inkjet deposition. Continuous Argon ion laser was irradiated locally to evaporate the carrier solvent as well as to sinter gold nano-particles. In addition, a new method for the selective ablation of multilayered gold nanoparticle film was demonstrated.
AB - The low temperature fabrication of active (field effect transistor) electrical components on flexible polymer substrates is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print gold nano-particles suspended in organic solvent, PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent, semiconductor polymer in organic solvent to fabricate passive and active electrical components on flexible polymer substrates. Short pulsed laser ablation enabled finer electrical components to overcome the resolution limitation of inkjet deposition. Continuous Argon ion laser was irradiated locally to evaporate the carrier solvent as well as to sinter gold nano-particles. In addition, a new method for the selective ablation of multilayered gold nanoparticle film was demonstrated.
KW - Flexible electronics
KW - Inkjet printing
KW - Laser ablation and sintering
KW - Nanoparticle
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U2 - 10.1117/12.697336
DO - 10.1117/12.697336
M3 - Conference contribution
AN - SCOPUS:34248593208
SN - 0819465720
SN - 9780819465726
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Laser-based Micro- and Nanopackaging and Assembly
T2 - Laser-based Micro- and Nanopackaging and Assembly
Y2 - 22 January 2007 through 24 January 2007
ER -