Laser-assisted maskless fabrication of flexible electronics

Costas P. Grigoropoulos; Seung Hwan Ko; Heng Pan; Jaewon Chung; Dimos Poulikakos

doi:10.1117/12.697336

Laser-assisted maskless fabrication of flexible electronics

Costas P. Grigoropoulos, Seung Hwan Ko, Heng Pan, Jaewon Chung, Dimos Poulikakos

School of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

The low temperature fabrication of active (field effect transistor) electrical components on flexible polymer substrates is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print gold nano-particles suspended in organic solvent, PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent, semiconductor polymer in organic solvent to fabricate passive and active electrical components on flexible polymer substrates. Short pulsed laser ablation enabled finer electrical components to overcome the resolution limitation of inkjet deposition. Continuous Argon ion laser was irradiated locally to evaporate the carrier solvent as well as to sinter gold nano-particles. In addition, a new method for the selective ablation of multilayered gold nanoparticle film was demonstrated.

Original language	English
Title of host publication	Laser-based Micro- and Nanopackaging and Assembly
DOIs	https://doi.org/10.1117/12.697336
Publication status	Published - 2007
Event	Laser-based Micro- and Nanopackaging and Assembly - San Jose, CA, United States Duration: 2007 Jan 22 → 2007 Jan 24

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	6459
ISSN (Print)	0277-786X

Other

Other	Laser-based Micro- and Nanopackaging and Assembly
Country	United States
City	San Jose, CA
Period	07/1/22 → 07/1/24

Keywords

Flexible electronics
Inkjet printing
Laser ablation and sintering
Nanoparticle

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

Access to Document

10.1117/12.697336

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Cite this

Grigoropoulos, C. P., Ko, S. H., Pan, H., Chung, J., & Poulikakos, D. (2007). Laser-assisted maskless fabrication of flexible electronics. In Laser-based Micro- and Nanopackaging and Assembly [64590V] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6459). https://doi.org/10.1117/12.697336

Laser-assisted maskless fabrication of flexible electronics. / Grigoropoulos, Costas P.; Ko, Seung Hwan; Pan, Heng; Chung, Jaewon; Poulikakos, Dimos.

Laser-based Micro- and Nanopackaging and Assembly. 2007. 64590V (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6459).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Grigoropoulos, CP, Ko, SH, Pan, H, Chung, J & Poulikakos, D 2007, Laser-assisted maskless fabrication of flexible electronics. in Laser-based Micro- and Nanopackaging and Assembly., 64590V, Proceedings of SPIE - The International Society for Optical Engineering, vol. 6459, Laser-based Micro- and Nanopackaging and Assembly, San Jose, CA, United States, 07/1/22. https://doi.org/10.1117/12.697336

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