Laser-assisted maskless fabrication of flexible electronics

Costas P. Grigoropoulos, Seung Hwan Ko, Heng Pan, Jaewon Chung, Dimos Poulikakos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The low temperature fabrication of active (field effect transistor) electrical components on flexible polymer substrates is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print gold nano-particles suspended in organic solvent, PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent, semiconductor polymer in organic solvent to fabricate passive and active electrical components on flexible polymer substrates. Short pulsed laser ablation enabled finer electrical components to overcome the resolution limitation of inkjet deposition. Continuous Argon ion laser was irradiated locally to evaporate the carrier solvent as well as to sinter gold nano-particles. In addition, a new method for the selective ablation of multilayered gold nanoparticle film was demonstrated.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
Volume6459
DOIs
Publication statusPublished - 2007 May 22
EventLaser-based Micro- and Nanopackaging and Assembly - San Jose, CA, United States
Duration: 2007 Jan 222007 Jan 24

Other

OtherLaser-based Micro- and Nanopackaging and Assembly
CountryUnited States
CitySan Jose, CA
Period07/1/2207/1/24

Fingerprint

Flexible electronics
Gold
Fabrication
Organic solvents
fabrication
Lasers
Polymers
gold
electronics
lasers
polymers
Laser ablation
Substrates
Field effect transistors
Ablation
Glycols
Pulsed lasers
Ink
Propylene
Argon

Keywords

  • Flexible electronics
  • Inkjet printing
  • Laser ablation and sintering
  • Nanoparticle

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Grigoropoulos, C. P., Ko, S. H., Pan, H., Chung, J., & Poulikakos, D. (2007). Laser-assisted maskless fabrication of flexible electronics. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 6459). [64590V] https://doi.org/10.1117/12.697336

Laser-assisted maskless fabrication of flexible electronics. / Grigoropoulos, Costas P.; Ko, Seung Hwan; Pan, Heng; Chung, Jaewon; Poulikakos, Dimos.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6459 2007. 64590V.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Grigoropoulos, CP, Ko, SH, Pan, H, Chung, J & Poulikakos, D 2007, Laser-assisted maskless fabrication of flexible electronics. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 6459, 64590V, Laser-based Micro- and Nanopackaging and Assembly, San Jose, CA, United States, 07/1/22. https://doi.org/10.1117/12.697336
Grigoropoulos CP, Ko SH, Pan H, Chung J, Poulikakos D. Laser-assisted maskless fabrication of flexible electronics. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6459. 2007. 64590V https://doi.org/10.1117/12.697336
Grigoropoulos, Costas P. ; Ko, Seung Hwan ; Pan, Heng ; Chung, Jaewon ; Poulikakos, Dimos. / Laser-assisted maskless fabrication of flexible electronics. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6459 2007.
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