Laser curing of gold nanoparticle inks

Jaewon Chung, Seunghwan Ko, Nicole R. Bieri, Costas P. Grigoropoulos, Dimos Poulikakos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The concept of effective laser curing of nanoparticle suspensions (NPS) with a laser beam is presented in this paper. A toluene solvent is employed as the carrier of gold nanoparticles possessing a lower melting temperature than thatof bulk gold. Using a modified drop-on-demand jetting system, the gold nanoparticle suspended solution is printed on a glass substrate and cured with laser irradiation. The laser energy coupling to the nanoparticles in conjunction with thermocapillary effects and the evaporation of the solvent are critical to the quality of the electrically conductive gold micro-lines. By employing a intensity-modulated double laser beam processing scheme, to optimize the curing process, it is demonstrated for the first time, that the gold nanoparticles could be sintered on a glass substrate to form a gold line of resistivity close to that of bulk gold. This is a noticeable result, compared to recently published microconductor manufacturing with nanoparticle suspensions with oven or low power single laser beam curing reporting resistivities four to five times higher than that of bulk gold. As a consequence, in addition to their scientific value, the current results demonstrate the potential of laser printing for use in the microelectronics manufacturing for the first time. It was also shown that the morphology of the gold line could be modified by appropriate design of the shape of the processing laser beam.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Pages131-140
Number of pages10
Volume374
Edition3
DOIs
Publication statusPublished - 2003
Externally publishedYes
Event2003 ASME International Mechanical Engineering Congress - Washington, DC., United States
Duration: 2003 Nov 152003 Nov 21

Other

Other2003 ASME International Mechanical Engineering Congress
CountryUnited States
CityWashington, DC.
Period03/11/1503/11/21

Fingerprint

Ink
Gold
Curing
Nanoparticles
Lasers
Laser beams
Suspensions
Glass
Toluene
Ovens
Substrates
Laser beam effects
Processing
Microelectronics
Melting point
Printing
Evaporation

Keywords

  • Drop-on-demand jetting
  • Laser curing
  • Marangoni effect
  • Nanoparticle suspension

ASJC Scopus subject areas

  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

Cite this

Chung, J., Ko, S., Bieri, N. R., Grigoropoulos, C. P., & Poulikakos, D. (2003). Laser curing of gold nanoparticle inks. In American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD (3 ed., Vol. 374, pp. 131-140) https://doi.org/10.1115/IMECE2003-41650

Laser curing of gold nanoparticle inks. / Chung, Jaewon; Ko, Seunghwan; Bieri, Nicole R.; Grigoropoulos, Costas P.; Poulikakos, Dimos.

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. Vol. 374 3. ed. 2003. p. 131-140.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chung, J, Ko, S, Bieri, NR, Grigoropoulos, CP & Poulikakos, D 2003, Laser curing of gold nanoparticle inks. in American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. 3 edn, vol. 374, pp. 131-140, 2003 ASME International Mechanical Engineering Congress, Washington, DC., United States, 03/11/15. https://doi.org/10.1115/IMECE2003-41650
Chung J, Ko S, Bieri NR, Grigoropoulos CP, Poulikakos D. Laser curing of gold nanoparticle inks. In American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. 3 ed. Vol. 374. 2003. p. 131-140 https://doi.org/10.1115/IMECE2003-41650
Chung, Jaewon ; Ko, Seunghwan ; Bieri, Nicole R. ; Grigoropoulos, Costas P. ; Poulikakos, Dimos. / Laser curing of gold nanoparticle inks. American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. Vol. 374 3. ed. 2003. pp. 131-140
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