Abstract
Thermal cycling stress can result in fatigue cracks of interconnections between ribbon wires and the metallization of a photovoltaic (PV) module, thereby increasing its series resistance. Therefore, in this study, the thermal cycling (TC) history of PV modules exposed to two benchmark climate (Phoenix, AZ) has been derived employing corresponding meteorological data. Using the three parameters rain-flow counting algorithm, the number of TCs versus temperature change was calculated over one year. The number of rain-flow cycles was 935 in Phoenix. Furthermore, three types of accelerated tests were conducted to develop a lifetime prediction model. The Basquin equation was used to predict the number of cycles to failure, based on stress calculation. A finite element model for stress analysis was developed. Failure analysis shows that crack occurred at the solder joint after accelerated test.
| Original language | English |
|---|---|
| Title of host publication | Conference Record of the IEEE Photovoltaic Specialists Conference |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1575-1578 |
| Number of pages | 4 |
| ISBN (Print) | 9781479932993 |
| DOIs | |
| Publication status | Published - 2013 Jan 1 |
| Event | 39th IEEE Photovoltaic Specialists Conference, PVSC 2013 - Tampa, FL, United States Duration: 2013 Jun 16 → 2013 Jun 21 |
Other
| Other | 39th IEEE Photovoltaic Specialists Conference, PVSC 2013 |
|---|---|
| Country | United States |
| City | Tampa, FL |
| Period | 13/6/16 → 13/6/21 |
Fingerprint
Keywords
- Accelerated test
- Fatigue
- Lifetime
- PV module
- Solder joint
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Control and Systems Engineering
- Industrial and Manufacturing Engineering
Cite this
Lifetime prediction model of thermal fatigue stress on crystalline silicon photovoltaic module. / Park, Nochang; Han, Changwoon; Jeong, Jaeseong; Kim, Donghwan.
Conference Record of the IEEE Photovoltaic Specialists Conference. Institute of Electrical and Electronics Engineers Inc., 2013. p. 1575-1578 6744446.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Lifetime prediction model of thermal fatigue stress on crystalline silicon photovoltaic module
AU - Park, Nochang
AU - Han, Changwoon
AU - Jeong, Jaeseong
AU - Kim, Donghwan
PY - 2013/1/1
Y1 - 2013/1/1
N2 - Thermal cycling stress can result in fatigue cracks of interconnections between ribbon wires and the metallization of a photovoltaic (PV) module, thereby increasing its series resistance. Therefore, in this study, the thermal cycling (TC) history of PV modules exposed to two benchmark climate (Phoenix, AZ) has been derived employing corresponding meteorological data. Using the three parameters rain-flow counting algorithm, the number of TCs versus temperature change was calculated over one year. The number of rain-flow cycles was 935 in Phoenix. Furthermore, three types of accelerated tests were conducted to develop a lifetime prediction model. The Basquin equation was used to predict the number of cycles to failure, based on stress calculation. A finite element model for stress analysis was developed. Failure analysis shows that crack occurred at the solder joint after accelerated test.
AB - Thermal cycling stress can result in fatigue cracks of interconnections between ribbon wires and the metallization of a photovoltaic (PV) module, thereby increasing its series resistance. Therefore, in this study, the thermal cycling (TC) history of PV modules exposed to two benchmark climate (Phoenix, AZ) has been derived employing corresponding meteorological data. Using the three parameters rain-flow counting algorithm, the number of TCs versus temperature change was calculated over one year. The number of rain-flow cycles was 935 in Phoenix. Furthermore, three types of accelerated tests were conducted to develop a lifetime prediction model. The Basquin equation was used to predict the number of cycles to failure, based on stress calculation. A finite element model for stress analysis was developed. Failure analysis shows that crack occurred at the solder joint after accelerated test.
KW - Accelerated test
KW - Fatigue
KW - Lifetime
KW - PV module
KW - Solder joint
UR - http://www.scopus.com/inward/record.url?scp=84896453178&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84896453178&partnerID=8YFLogxK
U2 - 10.1109/PVSC.2013.6744446
DO - 10.1109/PVSC.2013.6744446
M3 - Conference contribution
AN - SCOPUS:84896453178
SN - 9781479932993
SP - 1575
EP - 1578
BT - Conference Record of the IEEE Photovoltaic Specialists Conference
PB - Institute of Electrical and Electronics Engineers Inc.
ER -