Low Cost Hardware Implementation of LEA-128 Encryption using Bit-Serial Technique

Byungjun Choi, Bohun Kim, Jongsun Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The Lightweight Encryption Algorithm (LEA) is a block cipher algorithm developed to provide confidentiality in high-speed environments, big data, cloud, and mobile devices. There is an issue that these security algorithms' modules must be small in area and power in order to be loaded onto resource constraint devices such as passive RFID. In this paper, for the first time in LEA which is one of the block ciphers, Bit-Serial technique is used to realize small area and power. Using Samsung 65nm process, we could obtain 2240GE which is 49.8% less in terms of area compared to the state-of-the-art area-optimized LEA-128. The IP designed in this paper can be applied as a security module to resource constraint devices.

Original languageEnglish
Title of host publicationProceedings - International SoC Design Conference 2018, ISOCC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages46-47
Number of pages2
ISBN (Electronic)9781538679609
DOIs
Publication statusPublished - 2019 Feb 22
Event15th International SoC Design Conference, ISOCC 2018 - Daegu, Korea, Republic of
Duration: 2018 Nov 122018 Nov 15

Publication series

NameProceedings - International SoC Design Conference 2018, ISOCC 2018

Conference

Conference15th International SoC Design Conference, ISOCC 2018
CountryKorea, Republic of
CityDaegu
Period18/11/1218/11/15

Keywords

  • Bit-Serial
  • LEA

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Choi, B., Kim, B., & Park, J. (2019). Low Cost Hardware Implementation of LEA-128 Encryption using Bit-Serial Technique. In Proceedings - International SoC Design Conference 2018, ISOCC 2018 (pp. 46-47). [8649937] (Proceedings - International SoC Design Conference 2018, ISOCC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2018.8649937