TY - GEN
T1 - Low Cost Hardware Implementation of LEA-128 Encryption using Bit-Serial Technique
AU - Choi, Byungjun
AU - Kim, Bohun
AU - Park, Jongsun
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported as part of Military Crypto Research Center(UD170109ED) funded by Defense Acquisition Program Administration(DAPA) and Agency for Defense Development(ADD).
Publisher Copyright:
© 2018 IEEE.
PY - 2019/2/22
Y1 - 2019/2/22
N2 - The Lightweight Encryption Algorithm (LEA) is a block cipher algorithm developed to provide confidentiality in high-speed environments, big data, cloud, and mobile devices. There is an issue that these security algorithms' modules must be small in area and power in order to be loaded onto resource constraint devices such as passive RFID. In this paper, for the first time in LEA which is one of the block ciphers, Bit-Serial technique is used to realize small area and power. Using Samsung 65nm process, we could obtain 2240GE which is 49.8% less in terms of area compared to the state-of-the-art area-optimized LEA-128. The IP designed in this paper can be applied as a security module to resource constraint devices.
AB - The Lightweight Encryption Algorithm (LEA) is a block cipher algorithm developed to provide confidentiality in high-speed environments, big data, cloud, and mobile devices. There is an issue that these security algorithms' modules must be small in area and power in order to be loaded onto resource constraint devices such as passive RFID. In this paper, for the first time in LEA which is one of the block ciphers, Bit-Serial technique is used to realize small area and power. Using Samsung 65nm process, we could obtain 2240GE which is 49.8% less in terms of area compared to the state-of-the-art area-optimized LEA-128. The IP designed in this paper can be applied as a security module to resource constraint devices.
KW - Bit-Serial
KW - LEA
UR - http://www.scopus.com/inward/record.url?scp=85063207890&partnerID=8YFLogxK
U2 - 10.1109/ISOCC.2018.8649937
DO - 10.1109/ISOCC.2018.8649937
M3 - Conference contribution
AN - SCOPUS:85063207890
T3 - Proceedings - International SoC Design Conference 2018, ISOCC 2018
SP - 46
EP - 47
BT - Proceedings - International SoC Design Conference 2018, ISOCC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 15th International SoC Design Conference, ISOCC 2018
Y2 - 12 November 2018 through 15 November 2018
ER -