Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction

Seung Hwan Lee, Seunggun Yu, Faisal Shahzad, Junpyo Hong, Seok Jin Noh, Woo Nyon Kim, Soon Man Hong, Chong Min Koo

Research output: Contribution to journalArticle

Abstract

Metal-coated polymer bead based composites are promising as electromagnetic interference (EMI) shielding and thermally conductive materials because they form a percolation 3D metal shell network at very low filler content. Herein, we fabricated 3D Cu/Ag shell network composites through electroless plating of metal on polymer beads and a simple hot pressing technique. Cu and Ag shells provide a continuous network for electron and heat conduction; thus, yielding excellent EMI shielding effectiveness of 110 dB at a 0.5 mm thickness and a thermal conductivity of 16.1 W m−1K−1 at only 13 vol % of metal filler. The properties of composites depend on the size of polystyrene (PS) beads and large size metal-coated PS bead composites exhibit higher electrical conductivity, EMI shielding effectiveness, and thermal conductivity than small size bead composites. These results are ascribed to the reduction in the number of contact interfaces between metal-coated beads, which minimizes the interfacial resistance. This study is set to pave the way for designing advanced EMI shielding and thermal conductive materials by a scalable and efficient synthesis approach.

Original languageEnglish
Article number107778
JournalComposites Science and Technology
Volume182
DOIs
Publication statusPublished - 2019 Sep 29

Fingerprint

Signal interference
Shielding
Metals
Composite materials
Conductive materials
Polystyrenes
Thermal conductivity
Polymers
Filler metals
Electroless plating
Hot pressing
Heat conduction
Fillers
Hot Temperature
Electrons

Keywords

  • 3D metal shell network
  • EMI shielding
  • Low percolation
  • Thermal conductivity

ASJC Scopus subject areas

  • Ceramics and Composites
  • Engineering(all)

Cite this

Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction. / Lee, Seung Hwan; Yu, Seunggun; Shahzad, Faisal; Hong, Junpyo; Noh, Seok Jin; Kim, Woo Nyon; Hong, Soon Man; Koo, Chong Min.

In: Composites Science and Technology, Vol. 182, 107778, 29.09.2019.

Research output: Contribution to journalArticle

Lee, Seung Hwan ; Yu, Seunggun ; Shahzad, Faisal ; Hong, Junpyo ; Noh, Seok Jin ; Kim, Woo Nyon ; Hong, Soon Man ; Koo, Chong Min. / Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction. In: Composites Science and Technology. 2019 ; Vol. 182.
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AU - Noh, Seok Jin

AU - Kim, Woo Nyon

AU - Hong, Soon Man

AU - Koo, Chong Min

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