Magnetically soft and electrically resistive CoNiFeS alloy films prepared by electrodeposition

Young-geun Kim, Hee Young Son, Young Sik Choi, Ki Seok Moon, Kuk Hyun Sunwoo

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

Magnetic properties of electrodeposited CoNiFeS films were studied to seek their feasibility for applications in microelectromagnetic devices such as high areal density recording heads. We started with NiFe and then expanded experiments to a CoNiFe system. Finally, we added a fourth element, sulfur, to further improve physical properties. A small amount of sulfur inclusion has induced grain size refinement and offered magnetic softness to the film accompanying with increased electrical resistivity. Grain size was found to be in the order of 10 nm. Co73Ni17Fe9S1 (in wt. %) films with thickness of 2.5 μm exhibit superior properties compared with currently utilized Ni45Fe55: high saturation magnetic flux density (Bs∼17 kG), low coercivity (Hc∼0.4 Oe), near zero saturation magnetostriction (λs∼1.0×10-6), high permeability (μ∼1300 at 100 MHz), and high electrical resistivity (ρ∼55 μΩ cm). From a processing standpoint, we were able to control film thickness uniformity by adjusting current distributions between the auxiliary electrode and cathode across 100 mm wafers.

Original languageEnglish
Pages (from-to)5413-5415
Number of pages3
JournalJournal of Applied Physics
Volume87
Issue number9 II
Publication statusPublished - 2000 May 1

Fingerprint

electrodeposition
sulfur
grain size
saturation
recording heads
electrical resistivity
softness
current distribution
magnetostriction
coercivity
magnetic flux
permeability
film thickness
flux density
physical properties
cathodes
adjusting
wafers
inclusions
magnetic properties

ASJC Scopus subject areas

  • Physics and Astronomy(all)
  • Physics and Astronomy (miscellaneous)

Cite this

Kim, Y., Son, H. Y., Choi, Y. S., Moon, K. S., & Sunwoo, K. H. (2000). Magnetically soft and electrically resistive CoNiFeS alloy films prepared by electrodeposition. Journal of Applied Physics, 87(9 II), 5413-5415.

Magnetically soft and electrically resistive CoNiFeS alloy films prepared by electrodeposition. / Kim, Young-geun; Son, Hee Young; Choi, Young Sik; Moon, Ki Seok; Sunwoo, Kuk Hyun.

In: Journal of Applied Physics, Vol. 87, No. 9 II, 01.05.2000, p. 5413-5415.

Research output: Contribution to journalArticle

Kim, Y, Son, HY, Choi, YS, Moon, KS & Sunwoo, KH 2000, 'Magnetically soft and electrically resistive CoNiFeS alloy films prepared by electrodeposition', Journal of Applied Physics, vol. 87, no. 9 II, pp. 5413-5415.
Kim, Young-geun ; Son, Hee Young ; Choi, Young Sik ; Moon, Ki Seok ; Sunwoo, Kuk Hyun. / Magnetically soft and electrically resistive CoNiFeS alloy films prepared by electrodeposition. In: Journal of Applied Physics. 2000 ; Vol. 87, No. 9 II. pp. 5413-5415.
@article{af7209dbb1e64c5589341d76a9b0c17f,
title = "Magnetically soft and electrically resistive CoNiFeS alloy films prepared by electrodeposition",
abstract = "Magnetic properties of electrodeposited CoNiFeS films were studied to seek their feasibility for applications in microelectromagnetic devices such as high areal density recording heads. We started with NiFe and then expanded experiments to a CoNiFe system. Finally, we added a fourth element, sulfur, to further improve physical properties. A small amount of sulfur inclusion has induced grain size refinement and offered magnetic softness to the film accompanying with increased electrical resistivity. Grain size was found to be in the order of 10 nm. Co73Ni17Fe9S1 (in wt. {\%}) films with thickness of 2.5 μm exhibit superior properties compared with currently utilized Ni45Fe55: high saturation magnetic flux density (Bs∼17 kG), low coercivity (Hc∼0.4 Oe), near zero saturation magnetostriction (λs∼1.0×10-6), high permeability (μ∼1300 at 100 MHz), and high electrical resistivity (ρ∼55 μΩ cm). From a processing standpoint, we were able to control film thickness uniformity by adjusting current distributions between the auxiliary electrode and cathode across 100 mm wafers.",
author = "Young-geun Kim and Son, {Hee Young} and Choi, {Young Sik} and Moon, {Ki Seok} and Sunwoo, {Kuk Hyun}",
year = "2000",
month = "5",
day = "1",
language = "English",
volume = "87",
pages = "5413--5415",
journal = "Journal of Applied Physics",
issn = "0021-8979",
publisher = "American Institute of Physics Publising LLC",
number = "9 II",

}

TY - JOUR

T1 - Magnetically soft and electrically resistive CoNiFeS alloy films prepared by electrodeposition

AU - Kim, Young-geun

AU - Son, Hee Young

AU - Choi, Young Sik

AU - Moon, Ki Seok

AU - Sunwoo, Kuk Hyun

PY - 2000/5/1

Y1 - 2000/5/1

N2 - Magnetic properties of electrodeposited CoNiFeS films were studied to seek their feasibility for applications in microelectromagnetic devices such as high areal density recording heads. We started with NiFe and then expanded experiments to a CoNiFe system. Finally, we added a fourth element, sulfur, to further improve physical properties. A small amount of sulfur inclusion has induced grain size refinement and offered magnetic softness to the film accompanying with increased electrical resistivity. Grain size was found to be in the order of 10 nm. Co73Ni17Fe9S1 (in wt. %) films with thickness of 2.5 μm exhibit superior properties compared with currently utilized Ni45Fe55: high saturation magnetic flux density (Bs∼17 kG), low coercivity (Hc∼0.4 Oe), near zero saturation magnetostriction (λs∼1.0×10-6), high permeability (μ∼1300 at 100 MHz), and high electrical resistivity (ρ∼55 μΩ cm). From a processing standpoint, we were able to control film thickness uniformity by adjusting current distributions between the auxiliary electrode and cathode across 100 mm wafers.

AB - Magnetic properties of electrodeposited CoNiFeS films were studied to seek their feasibility for applications in microelectromagnetic devices such as high areal density recording heads. We started with NiFe and then expanded experiments to a CoNiFe system. Finally, we added a fourth element, sulfur, to further improve physical properties. A small amount of sulfur inclusion has induced grain size refinement and offered magnetic softness to the film accompanying with increased electrical resistivity. Grain size was found to be in the order of 10 nm. Co73Ni17Fe9S1 (in wt. %) films with thickness of 2.5 μm exhibit superior properties compared with currently utilized Ni45Fe55: high saturation magnetic flux density (Bs∼17 kG), low coercivity (Hc∼0.4 Oe), near zero saturation magnetostriction (λs∼1.0×10-6), high permeability (μ∼1300 at 100 MHz), and high electrical resistivity (ρ∼55 μΩ cm). From a processing standpoint, we were able to control film thickness uniformity by adjusting current distributions between the auxiliary electrode and cathode across 100 mm wafers.

UR - http://www.scopus.com/inward/record.url?scp=0001750482&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0001750482&partnerID=8YFLogxK

M3 - Article

VL - 87

SP - 5413

EP - 5415

JO - Journal of Applied Physics

JF - Journal of Applied Physics

SN - 0021-8979

IS - 9 II

ER -