Magnetoresistance and interlayer diffusion in PtMn spin valves upon postdeposition annealing

Young-geun Kim, Seong Rae Lee, Se Ahn Song, Gyeong Su Park, Hyuck Soo Yang, K. I. Min

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

We report annealing time effects on the microstructural evolution and resultant magneto-transport property changes in Ta/NiFe/CoFe/Cu/CoFe/PtMn/Ta spin valves comprising PtMn layer thicknesses ranging from 10 to 30 nm. Postdeposition annealing was performed at 270°C up to 35 h, The blocking temperatures of samples with 20 nm PtMn and 30 nm PtMn layers were found to be 350°C and 400°C, respectively. The magnetoresistance and interlayer coupling field changes became large as annealing time increased, in particular, for samples with relatively thicker PtMn layers. The main cause of microstructural changes and property degradation was due to interlayer diffusion of atomic constituents such as Mn, most likely through grain boundaries. Light B doping (1 at. %) in both free and pinned CoFe layers was proven effective in terms of blocking diffusion processes.

Original languageEnglish
Pages (from-to)6907-6909
Number of pages3
JournalJournal of Applied Physics
Volume89
Issue number11 II
DOIs
Publication statusPublished - 2001 Jun 1

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interlayers
annealing
grain boundaries
transport properties
degradation
causes
temperature

ASJC Scopus subject areas

  • Physics and Astronomy(all)
  • Physics and Astronomy (miscellaneous)

Cite this

Magnetoresistance and interlayer diffusion in PtMn spin valves upon postdeposition annealing. / Kim, Young-geun; Lee, Seong Rae; Song, Se Ahn; Park, Gyeong Su; Yang, Hyuck Soo; Min, K. I.

In: Journal of Applied Physics, Vol. 89, No. 11 II, 01.06.2001, p. 6907-6909.

Research output: Contribution to journalArticle

Kim, Young-geun ; Lee, Seong Rae ; Song, Se Ahn ; Park, Gyeong Su ; Yang, Hyuck Soo ; Min, K. I. / Magnetoresistance and interlayer diffusion in PtMn spin valves upon postdeposition annealing. In: Journal of Applied Physics. 2001 ; Vol. 89, No. 11 II. pp. 6907-6909.
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