Mathematical modelling and measurement of etching profile for junction shape control in MR read heads

Won Je Jeong, E. Y. Shong, H. J. Hahm, K. I. Min, Young K. Kim

Research output: Contribution to journalConference articlepeer-review

Abstract

A mathematical model was generated to predict the junction profile between MR element and hard bias element. Etching rates as a function of incident beam angle for relevant materials were experimentally determined for this model. Key process parameters such as stencil structure, ion beam angle, and MR element structure were varied. A series of experiments were made to confirm the model prediction by employing atomic force microscopy. We have found, for example, when the sidewall of a stencil was vertical, the junction angle became small resulting from the shadowing of incident ion beams. In addition, when a thin Ta layer was inserted between the MR element and bottom gap layer, the junction angle was increased.

Original languageEnglish
Pages (from-to)DB-04
JournalDigests of the Intermag Conference
Publication statusPublished - 1999
Externally publishedYes
EventProceedings of the 1999 IEEE International Magnetics Conference 'Digest of Intermag 99' - Kyongju, South Korea
Duration: 1999 May 181999 May 21

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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