Melt processible conducting polyaniline blend: Mechanical and electrical properties

Dong Hyun Kim, Tae Hee Lee, Jong Eun Kim, Kwang Suck Suh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The effect of melt mixing process of conducting polymer, polyaniline with polystyrene was investigated. Polyaniline-dodecylbenzensulfonic acid (PANI - DBSA ) complex was obtained by a one step emulsion polymerization for conducting blends. Polyaniline / Polystyrene conducting blends were prepared and mechanical properties such as tensile strength, elongation at break, modulus and electrical properties such as surface resistance, electrical conductivity, volume resistance and dielectric loss tangent were measured. It was found that the conductivity of polyaniline masterbatch is 6.99 S/cm and the percolation threshould of polyaniline blend was relatively low about 5 phr of polyaniline. The morphology of blends was setting closer to that of polyaniline and the dielectric loss increased up to 105 at 50% of polyaniline and was more dependent on temperature than frequency at higher polyaniline concentration.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials
Pages726-728
Number of pages3
Volume2
Publication statusPublished - 2003 Oct 20
EventProceedings of the 7th International Conference on Properties and Applications of Dielectric Materials - Nagoya, Japan
Duration: 2003 Jun 12003 Jun 5

Other

OtherProceedings of the 7th International Conference on Properties and Applications of Dielectric Materials
CountryJapan
CityNagoya
Period03/6/103/6/5

Fingerprint

Polyaniline
Electric properties
Mechanical properties
Polystyrenes
Dielectric losses
polyaniline
Surface resistance
Emulsion polymerization
Conducting polymers
Elongation
Tensile strength
Acids

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kim, D. H., Lee, T. H., Kim, J. E., & Suh, K. S. (2003). Melt processible conducting polyaniline blend: Mechanical and electrical properties. In Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials (Vol. 2, pp. 726-728)

Melt processible conducting polyaniline blend : Mechanical and electrical properties. / Kim, Dong Hyun; Lee, Tae Hee; Kim, Jong Eun; Suh, Kwang Suck.

Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials. Vol. 2 2003. p. 726-728.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kim, DH, Lee, TH, Kim, JE & Suh, KS 2003, Melt processible conducting polyaniline blend: Mechanical and electrical properties. in Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials. vol. 2, pp. 726-728, Proceedings of the 7th International Conference on Properties and Applications of Dielectric Materials, Nagoya, Japan, 03/6/1.
Kim DH, Lee TH, Kim JE, Suh KS. Melt processible conducting polyaniline blend: Mechanical and electrical properties. In Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials. Vol. 2. 2003. p. 726-728
Kim, Dong Hyun ; Lee, Tae Hee ; Kim, Jong Eun ; Suh, Kwang Suck. / Melt processible conducting polyaniline blend : Mechanical and electrical properties. Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials. Vol. 2 2003. pp. 726-728
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