Microstructuring by printing and laser curing of nanoparticle solutions

N. R. Bieri, Jaewon Chung, S. E. Haferl, D. Poulikakos, C. P. Grigoropoulos

Research output: Contribution to journalArticle

137 Citations (Scopus)

Abstract

The process of printing and laser curing of nanoparticle solutions was studied. A liquid solvent was used as a carrier of gold naoparticles possessing a low-melting temperature compared to that of bulk gold. An optical method for estimating the curing times was also developed and discussed. The interaction between the laser radiation and nanoparticles drives the solvent evaporation and controls the quality of the microstructures printing process.

Original languageEnglish
Pages (from-to)3529-3531
Number of pages3
JournalApplied Physics Letters
Volume82
Issue number20
DOIs
Publication statusPublished - 2003 May 19
Externally publishedYes

Fingerprint

curing
printing
gold
nanoparticles
lasers
estimating
melting
evaporation
laser beams
optics
microstructure
liquids
interactions
temperature

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Bieri, N. R., Chung, J., Haferl, S. E., Poulikakos, D., & Grigoropoulos, C. P. (2003). Microstructuring by printing and laser curing of nanoparticle solutions. Applied Physics Letters, 82(20), 3529-3531. https://doi.org/10.1063/1.1575502

Microstructuring by printing and laser curing of nanoparticle solutions. / Bieri, N. R.; Chung, Jaewon; Haferl, S. E.; Poulikakos, D.; Grigoropoulos, C. P.

In: Applied Physics Letters, Vol. 82, No. 20, 19.05.2003, p. 3529-3531.

Research output: Contribution to journalArticle

Bieri, NR, Chung, J, Haferl, SE, Poulikakos, D & Grigoropoulos, CP 2003, 'Microstructuring by printing and laser curing of nanoparticle solutions', Applied Physics Letters, vol. 82, no. 20, pp. 3529-3531. https://doi.org/10.1063/1.1575502
Bieri, N. R. ; Chung, Jaewon ; Haferl, S. E. ; Poulikakos, D. ; Grigoropoulos, C. P. / Microstructuring by printing and laser curing of nanoparticle solutions. In: Applied Physics Letters. 2003 ; Vol. 82, No. 20. pp. 3529-3531.
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