@inproceedings{d3e7219144bd4cf594ba0ff5563c8665,
title = "Millimeter-wave band CMOS RF phased-array transceiver IC designs for 5G applications",
abstract = "This paper presents design challenges and solutions for the fifth generation (5G) phased-array transceiver ICs in millimeter-wave (MMW) frequency bands. A 28nm bulk CMOS device technology is selected to integrate multiple RF phased-array elements in a single-chip to achieve a high-level of TX EIRP and RX sensitivity. Several design approaches of gain, POUT, stability, reliability and linearity enhancement techniques are applied to enable CMOS as a key device solution for 5G applications in MMW frequency bands. A 39GHz band 16-channel CMOS RF phased-array transceiver IC is designed and can support 4T/4R MIMO base-station applications including ×64 RF phased-array ICs (total 1, 024 phased-array elements). T/RX paths have gain dynamic ranges of >30/40dB for flexibility and scalability. The TX path shows POUT/Ch. of >6.0dBm at EVM of -34dB (800MHz) and PDC/Ch. of 105mW. The RX path performs NF of 4.2dB, EVM of -38dB (100MHz) and PDC/Ch. of 39mW. These state-of-the-art results lead to TX EIRP of >55dBm and RX sensitivity of <-113dBm/100MHz in the 5G NR base-station system.",
author = "Park, {H. C.} and D. Kang and J. Lee and D. Minn and Y. Aoki and K. Kim and S. Lee and D. Lee and S. Kim and J. Kim and W. Lee and C. Kim and S. Park and J. Park and B. Suh and J. Jang and M. Kim and K. Min and S. Jeon and Ryu, {A. S.} and Y. Kim and Lee, {J. H.} and J. Son and Yang, {S. G.}",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 66th Annual IEEE International Electron Devices Meeting, IEDM 2020 ; Conference date: 12-12-2020 Through 18-12-2020",
year = "2020",
month = dec,
day = "12",
doi = "10.1109/IEDM13553.2020.9371948",
language = "English",
series = "Technical Digest - International Electron Devices Meeting, IEDM",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "17.2.1--17.2.4",
booktitle = "2020 IEEE International Electron Devices Meeting, IEDM 2020",
}