TY - GEN
T1 - Mm-wave CMOS Matrix Distributed Amplifier for Ultra-Wideband Applications
AU - Park, Gunwoo
AU - Kim, Minwoo
AU - Jeon, Sanggeun
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - This paper presents an mm-wave CMOS matrix distributed amplifier (matrix-DA) exhibiting an ultra-wide bandwidth. The amplifier consists of multi-Tiered DAs and an on-chip inductive bias network. The distributed line length is optimized for dealing with a tradeoff between the impedance matching and bandwidth. The output signals from each gain cell are coherently added by adopting the group-delay equalization technique. Peaking lines are inserted at the interstage network to increase the gain-bandwidth product (GBP). The experimental results show that a nominal gain of 6.2 dB and a 3-dB bandwidth of 70 GHz is achieved. The GBP reaches 142.9 GHz. The return loss is higher than 10 dB over the entire 3-dB bandwidth. The chip size is 0.81 mm2.
AB - This paper presents an mm-wave CMOS matrix distributed amplifier (matrix-DA) exhibiting an ultra-wide bandwidth. The amplifier consists of multi-Tiered DAs and an on-chip inductive bias network. The distributed line length is optimized for dealing with a tradeoff between the impedance matching and bandwidth. The output signals from each gain cell are coherently added by adopting the group-delay equalization technique. Peaking lines are inserted at the interstage network to increase the gain-bandwidth product (GBP). The experimental results show that a nominal gain of 6.2 dB and a 3-dB bandwidth of 70 GHz is achieved. The GBP reaches 142.9 GHz. The return loss is higher than 10 dB over the entire 3-dB bandwidth. The chip size is 0.81 mm2.
KW - CMOS 65nm process technology
KW - gain-bandwidth product
KW - group-delay equalization
KW - matrix distributed amplifier
UR - http://www.scopus.com/inward/record.url?scp=85139132813&partnerID=8YFLogxK
U2 - 10.1109/RFIT54256.2022.9882407
DO - 10.1109/RFIT54256.2022.9882407
M3 - Conference contribution
AN - SCOPUS:85139132813
T3 - RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology
SP - 200
EP - 203
BT - RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022
Y2 - 29 August 2022 through 31 August 2022
ER -