Modeling and simulation study of survivability mechanisms in WDM-based high-speed networks

Latha Kant, Hyogon Kim, Deh Phone Hsing, Tsong Ho Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The ever-growing need for high bandwidth and low latency is spurring research into the use of novel networking technologies that can provide ultra-high-speed information transfer. The recent technological advancements in the field of WDMs, render WDM-based networks a promising architectural candidate. In this paper, we propose two candidate architectures that employ IP, ATM and WDM technologies, i.e., ATM-over-WDM and IP-over-WDM. Further, we observe that service survivability (i.e., continued service provision in the event of network facility failures) is a very important concern since service disruption at high-speeds can cause a considerable amount of loss. Hence, we also propose restoration strategies that can tap the advantages of the various technologies and provide service survivability. We use modeling and simulation techniques to study the performance of the proposed survivability mechanisms and report our results in this paper.

Original languageEnglish
Title of host publicationConference Record / IEEE Global Telecommunications Conference
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Volume1
Publication statusPublished - 1999 Dec 1
Externally publishedYes
Event1999 IEEE Global Telecommunication Conference - GLOBECOM'99 - Rio de Janeiro, Braz
Duration: 1999 Dec 51999 Dec 9

Other

Other1999 IEEE Global Telecommunication Conference - GLOBECOM'99
CityRio de Janeiro, Braz
Period99/12/599/12/9

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Global and Planetary Change

Cite this

Kant, L., Kim, H., Hsing, D. P., & Wu, T. H. (1999). Modeling and simulation study of survivability mechanisms in WDM-based high-speed networks. In Conference Record / IEEE Global Telecommunications Conference (Vol. 1). Piscataway, NJ, United States: IEEE.