Molecular dynamics simulation of strain relaxation in Cu thin films on Ni(0 0 1)

Seong Jin Kim, Min Hyung Cho, Jang Hyuk Yoon, Ho Jang

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Atomistic details of an interfacial structure of Cu thin films on a Ni(0 0 1) substrate are investigated by molecular dynamics simulation using embedded atom method potentials. Results confirm the formation of stripes on the film surface with embedded {1 1 1} wedges, as reported by Müller et al., Phys Rev Lett 1996;76:2358, but suggest a different critical thickness (up to 11 Å) for appearance of the stripes.

Original languageEnglish
Pages (from-to)1105-1109
Number of pages5
JournalScripta Materialia
Volume52
Issue number11
DOIs
Publication statusPublished - 2005 Jun 1

Fingerprint

Strain relaxation
embedded atom method
wedges
Molecular dynamics
molecular dynamics
Thin films
Atoms
Computer simulation
Substrates
thin films
simulation

Keywords

  • Interfaces
  • Molecular dynamics
  • Strain relaxation
  • Thin films

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Metals and Alloys

Cite this

Molecular dynamics simulation of strain relaxation in Cu thin films on Ni(0 0 1). / Kim, Seong Jin; Cho, Min Hyung; Yoon, Jang Hyuk; Jang, Ho.

In: Scripta Materialia, Vol. 52, No. 11, 01.06.2005, p. 1105-1109.

Research output: Contribution to journalArticle

Kim, Seong Jin ; Cho, Min Hyung ; Yoon, Jang Hyuk ; Jang, Ho. / Molecular dynamics simulation of strain relaxation in Cu thin films on Ni(0 0 1). In: Scripta Materialia. 2005 ; Vol. 52, No. 11. pp. 1105-1109.
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